Optical Module Glass Substrate Thermal Via Design
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Solution Overview
Problem
Existing optical modules face challenges in effectively dissipating heat from optical elements and efficiently inputting and outputting optical signals, especially in narrow spaces where heat dissipation and signal transmission are compromised.
Innovation Solution
The optical module incorporates a glass substrate with a thermally conductive via connecting the optical element to a thermally conductive member, and uses waveguides for optical signal input and output, with the substrate and waveguides designed to minimize signal reflection and enhance thermal conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If optical elements are mounted in narrow spaces to reduce module size, then compactness is improved, but heat dissipation becomes insufficient
Solution Approach 1:
The patent applies local quality by providing a thermally conductive member specifically at the location of the optical element's mounting position, rather than uniformly throughout the entire module. This localized thermal management solution addresses the heat dissipation problem in the specific narrow space where the optical element is mounted, without requiring the entire module to be enlarged for heat dissipation purposes.
Solution Approach 2:
The patent uses composite materials by combining the glass substrate with a thermally conductive member that has higher thermal conductivity than the substrate material. This composite structure allows the module to maintain its compact size while achieving effective heat dissipation through the thermally conductive member that is integrated at the critical heat-generating location.
2Ease of manufacture
If conventional mounting methods are used, then manufacturing simplicity is maintained, but optical signal transmission efficiency deteriorates due to signal reflection
Solution Approach 1:
The patent applies parameter changes by carefully controlling the refractive index of the adhesive material used to mount the optical element. By matching or optimizing the adhesive's refractive index relative to the optical element and surrounding media, the patent minimizes optical reflection at the interfaces while maintaining the simplicity of adhesive-based mounting. This parameter optimization resolves the contradiction between easy manufacturing and signal transmission efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows for effective heat dissipation from optical elements and reliable optical signal transmission with reduced signal reflection and increased module reliability, even in compact designs.
Implementation Method 1
a thermally conductive member mounted on the second surface and thermally connected to the optical element through the via
Data Source
AI summary
An optical module according to one embodiment includes a substrate made of glass and having a first surface, a second surface opposite to the first surface, a via penetrating between the first surface and the second surface, and a first waveguide provided between the first surface and the second surface; an optical element that is mounted on the first surface, and that inputs and outputs an optical signal; a thermally conductive member mounted on the second surface and thermally connected to the optical element through the via; and a second waveguide provided on the first surface. The optical signal is input to and output from an outside through the second waveguide and the first waveguide.


