Optical Module Groove Alignment for Silicon Photonics
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Solution Overview
Problem
The existing optical modules require high-precision active alignment of single-mode fibers with silicon photonics components, which is time-consuming and requires specialized equipment, necessitating a more efficient alignment technique.
Innovation Solution
The optical module design includes a substrate with a first and second cladding layer, featuring grooves that facilitate the precise alignment of a silicon photonics component and a single-mode fiber, where the fiber is fitted into a second groove with tapered walls, allowing for accurate positioning of the optical axis and core without the need for active alignment tools.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If active alignment is performed to achieve high-precision alignment between single-mode fiber and silicon photonics component, then alignment precision is improved, but alignment time and device complexity increase
Solution Approach 1:
The groove structure is formed in advance on the substrate before the actual alignment process. The groove has a bottom surface and side surfaces that pre-establish the positional relationship between the silicon photonics component and single-mode fiber, eliminating the need for time-consuming active alignment adjustments during assembly
Solution Approach 2:
The groove acts as an intermediary structure that mediates the alignment between the silicon photonics component and single-mode fiber. By providing fixed reference surfaces (bottom surface and side surfaces), the groove serves as a mechanical mediator that ensures precise alignment without requiring complex active alignment equipment
2Manufacturing precision
If active alignment is performed to achieve high-precision alignment between single-mode fiber and silicon photonics component, then alignment precision is improved, but device complexity and equipment requirements increase
Solution Approach 1:
The groove structure enables self-alignment functionality. When the silicon photonics component is placed in the groove, its lower surface contacts the bottom surface and its side surface contacts the side surfaces of the groove, automatically establishing the correct positional relationship without requiring external alignment equipment or complex adjustment mechanisms
3Device complexity
If conventional alignment methods are used without groove structure, then device structure is simpler, but alignment precision deteriorates
Solution Approach 1:
The groove structure introduces a vertical dimension (depth direction) to the alignment process. By forming the groove with specific depth and providing a bottom surface, the invention adds a Z-axis constraint to the alignment, complementing the X-Y plane positioning and achieving three-dimensional precise alignment while maintaining relatively simple device structure
Data Source
AI summary
An optical module includes a first cladding layer formed on a substrate, a first groove extending through the first cladding layer in a thickness direction, and a second cladding layer formed on the first cladding layer. The optical module further includes a second groove extending through the first cladding layer and the second cladding layer in the thickness direction, a silicon photonics component mounted on the first cladding layer, and a single-mode fiber fitted into the second groove. The silicon photonics component includes a main body and an optical axis located below the main body. The lower surface of the main body is in contact with the upper surface of the first cladding layer. The optical axis is retained within the first groove. A circumferential surface of the single-mode fiber is in contact with a bottom surface of the second groove and a wall surface of the second groove.