Optical Module Package With Metal-Filled Groove Shielding
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Solution Overview
Problem
Existing optical module packages face challenges in effectively suppressing crosstalk between signal terminals, particularly at high signal speeds, due to inadequate shielding and electromagnetic field leakage.
Innovation Solution
The optical module package incorporates a substrate with a first wiring layer that includes signal and ground terminals, and a second wiring layer with a ground pattern that extends in both directions. A groove filled with metal is provided within the ground terminal, acting as a shield to block electromagnetic interference between signal terminals.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If conventional wiring structures are used without additional shielding, then device complexity is reduced, but crosstalk between signal terminals increases at high signal speeds
Solution Approach 1:
The invention introduces a groove dimension within the ground terminal structure, transforming a planar wiring layout into a three-dimensional configuration. The groove extends in the thickness direction of the substrate, creating a shielded cavity that blocks electromagnetic field leakage without adding lateral complexity to the wiring routing.
Solution Approach 2:
The groove filled with metal acts as an intermediary shielding structure between adjacent signal terminals. This intermediate element intercepts and contains electromagnetic fields, preventing them from coupling into neighboring signal lines, thereby reducing crosstalk while maintaining the original signal terminal arrangement.
2Object-affected harmful factors
If ground terminals are enlarged to improve shielding, then crosstalk suppression improves, but area occupied by ground terminals increases
Solution Approach 1:
Instead of expanding the ground terminal area in the planar direction, the invention utilizes the thickness dimension by forming a groove that extends vertically. This three-dimensional approach provides effective electromagnetic shielding while maintaining the original footprint of the ground terminal on the substrate surface.
Solution Approach 2:
The groove structure is nested within the ground terminal itself, creating a shielded cavity inside the existing terminal boundary. This nested configuration provides enhanced electromagnetic field containment without requiring additional space outside the original ground terminal area.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration significantly reduces crosstalk between adjacent signal terminals, even at high signal speeds, by effectively shielding electromagnetic fields, thereby improving signal integrity and reducing noise interference.
Implementation Method 1
The second wiring layer includes a groove extending along the first direction, the groove being filled with a metal. The groove is provided within the first ground terminal, in a plan view. The first insulating layer is free of the groove. The first ground terminal is electrically coupled to the first ground pattern through the metal of the groove.
Data Source
AI summary
A package for an optical module includes a substrate provided through a side wall in a first direction. The substrate includes a first wiring layer including a first signal terminal, a second signal terminal, and a first ground terminal. The package includes a second wiring layer disposed under the first wiring layer. The second wiring layer includes a first ground pattern and a first insulating layer disposed between the first wiring layer and the second wiring layer, and includes a groove extending along the first direction, the groove being filled with a metal. The groove is provided within the first ground terminal, in a plan view, and the first insulating layer is free of the groove. The first ground terminal is electrically coupled to the first ground pattern through the metal of the groove.