Optical Module Signal Routing with Ground Pad Shielding
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Solution Overview
Problem
In optic fiber communications, existing optical modules face challenges in minimizing crosstalk between signal wires due to varying distances and orientations of signal interface pads, which affects signal transmission quality and interference robustness.
Innovation Solution
The optical module design includes a chip with signal interface pads arranged parallel to its wiring side, connected to corresponding pads on a circuit board with varying distances and orientations, using signal wires to avoid wire intersections and crosstalk, and additional ground pads to provide reflowing paths for high-speed signals, reducing energy radiation and crosstalk.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If signal interface pads are arranged with varying distances and orientations on the circuit board, then connection flexibility is improved, but crosstalk between signal wires increases
Solution Approach 1:
Ground pads are introduced as intermediary elements between signal interface pads and signal wires. These ground pads provide reference potential and create electromagnetic shielding, thereby reducing crosstalk while maintaining the flexible arrangement of signal pads with varying distances and orientations on the circuit board.
Solution Approach 2:
The patent applies different arrangements of ground pads around different signal interface pads based on their specific positions and orientations. Each signal wire connection is locally optimized with ground pads positioned to provide maximum shielding for that particular signal path, allowing the system to maintain both flexibility and low crosstalk.
2Object-generated harmful factors
If signal wires are configured to avoid intersections, then crosstalk is reduced, but wire length and routing complexity increase
Solution Approach 1:
Ground pads serve as intermediary connection points that simplify wire routing. By providing fixed reference points and electromagnetic shielding zones, ground pads allow signal wires to be routed more directly without complex avoidance maneuvers, reducing both crosstalk and routing complexity simultaneously.
3Loss of energy
If ground pads are added to provide reflowing paths, then energy radiation is reduced, but device complexity increases
Solution Approach 1:
The ground pads are merged with the existing signal interface pad structure on the circuit board. The ground pads are integrated into the same substrate and wiring system, providing reflowing paths for high-speed signals while sharing the same physical space and manufacturing process, thereby minimizing the increase in device complexity.
Solution Approach 2:
The ground pads perform multiple functions: they provide reference potential for signal wires, create electromagnetic shielding to reduce radiation, and serve as connection points in the reflowing path for high-speed signals. This multi-functionality justifies their addition by delivering multiple benefits from a single structural element.
Data Source
AI summary
The disclosure discloses an optical module, and relates to the field of optic fiber communications. A circuit according to an embodiment of the disclosure includes: a chip, which includes at least one wiring side, and on which there are arranged first signal interface pads arranged parallel to the wiring side; a circuit board on which there are arranged a number of second signal interface pads corresponding to the first signal interface pads, wherein at least two of the distances between the respective second signal interface pads and the wiring side are different from each other; and signal wires configured to connect the corresponding first signal interface pads and second signal interface pads.