Optical Module Ground Wire Stabilizes Metal Layer Potential
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Solution Overview
Problem
The existing TO-CAN type optical modules experience signal transmission loss due to unstable ground potential and weak electromagnetic field confinement, particularly with protruding lead pins acting as antenna elements, which is exacerbated by high-frequency signal interference.
Innovation Solution
The optical module incorporates a conductive block with through holes, insulated lead pins, a thermoelectric cooler with a metal layer on its upper surface connected via a ground wire to a conductive block, and a photoelectric device mounted on a substrate with a wiring pattern, stabilizing the potential and reducing signal loss.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If lead pins protrude to prevent interference with wire-bonding tools, then ease of manufacture is improved, but signal transmission loss increases due to antenna effect at high frequencies
Solution Approach 1:
The patent introduces a ground wire as an intermediary element that connects the conductive block to the metal layer on the thermoelectric cooler. This ground wire acts as a mediator to establish a stable reference potential, thereby reducing the antenna effect and signal transmission loss while maintaining the protruding lead pin structure for manufacturing accessibility.
Solution Approach 2:
The patent changes the electrical parameter of the metal layer by connecting it to the conductive block through a ground wire. This parameter change stabilizes the ground potential of the metal layer, transforming it from an unstable insulator surface to a stable reference potential, thereby reducing high-frequency signal interference.
2Device complexity
If the metal layer is laminated on the thermoelectric cooler without ground connection, then device complexity is reduced, but ground potential stability deteriorates
Solution Approach 1:
The ground wire serves as an intermediary that provides a simple yet effective connection between the conductive block and the metal layer. This single grounding element achieves ground potential stability without requiring complex grounding structures, thus maintaining low device complexity while improving potential stability.
3Loss of energy
If the metal layer is connected to the conductive block with a ground wire, then signal transmission loss is reduced, but device complexity increases
Solution Approach 1:
The ground wire is a simple intermediary element that effectively reduces signal transmission loss by stabilizing the ground potential. Its straightforward implementation as a single connection element minimizes the increase in device complexity while achieving the desired reduction in energy loss.
Solution Approach 2:
Instead of making the thermoelectric cooler itself conductive or complex, the patent inverts the approach by adding a simple ground connection to the existing metal layer. This inversion simplifies the solution by using a basic grounding element rather than modifying the fundamental properties of the thermoelectric cooler.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces signal transmission loss by stabilizing the potential of the metal layer, improving transmission characteristics as demonstrated by three-dimensional electric field analysis simulations.
Implementation Method 1
the thermoelectric cooler having a Peltier device therein configured to transfer heat between the upper surface and the lower surface
Implementation Method 2
a ground wire connecting the first surface of the conductive block and the metal layer
Data Source
AI summary
An optical module includes: a thermoelectric cooler with an upper surface and a lower surface, the lower surface fixed to the first surface of the conductive block, the thermoelectric cooler having a Peltier device therein configured to transfer heat between the upper surface and the lower surface; a metal layer laminated on the upper surface of the thermoelectric cooler; a ground wire connecting the first surface of the conductive block and the metal layer; a photoelectric device adapted to convert an optical signal and an electrical signal at least from one to another; a mounting substrate on which the photoelectric device is mounted, the mounting substrate fixed to the upper surface of the thermoelectric cooler with at least the metal layer interposed therebetween, the mounting substrate having a first wiring pattern electrically connected to the photoelectric device.