Optical Module Housing Structure for Faster Internal Heat Conduction
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Solution Overview
Problem
Existing optical modules suffer from poor internal heat dissipation due to inefficient air conduction, leading to high temperatures and reduced lifespan.
Innovation Solution
The optical module employs a first and second housing with protrusions and mating surfaces for solid heat conduction, utilizing internal gaps without increasing volume, and incorporating thermally conductive adhesives and special-shaped surfaces to enhance heat transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If air conduction is used for heat dissipation, then the structure is simple, but the heat dissipation efficiency is poor
Solution Approach 1:
The patent introduces a heat dissipation component as an intermediary between the optoelectronic component and the external environment. This component includes a heat dissipation surface that contacts the optoelectronic component and extends outward to increase the heat dissipation area, effectively mediating the heat transfer process and improving heat dissipation efficiency while maintaining structural simplicity.
Solution Approach 2:
The heat dissipation component extends in the vertical dimension from the optoelectronic component, creating additional heat dissipation surfaces at different heights. This dimensional extension increases the effective heat dissipation area without complicating the horizontal layout, resolving the contradiction between structural simplicity and heat dissipation efficiency.
2Device complexity
If a primary cooling surface is used on the external surface, then the structure is simple, but the internal heat transfer is inefficient
Solution Approach 1:
The heat dissipation component is segmented into multiple surfaces at different locations and orientations. The first heat dissipation surface contacts the optoelectronic component directly, while the second heat dissipation surface extends outward to the external environment. This segmentation creates multiple heat transfer pathways, improving internal heat transfer efficiency while keeping each segment structurally simple.
3Loss of energy
If the heat dissipation area is increased, then the heat dissipation efficiency improves, but the module volume increases
Solution Approach 1:
The heat dissipation component is nested within or integrated with the existing module housing structure. The heat dissipation surfaces are arranged to utilize the internal space of the module, with some surfaces positioned within the housing and others extending through or near the housing walls. This nesting approach increases heat dissipation area without significantly increasing the overall module volume.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design accelerates heat conduction, reduces temperature gradients, and significantly improves heat dissipation, maintaining module performance and extending lifespan.
Implementation Method 1
the heat generated by the optoelectronic component during operation can be conducted to the bottom wall of the first housing through the first protrusion, and the heat concentrated on the second housing can also be conducted to the bottom wall of the first housing through the first protrusion
Implementation Method 2
a thermally conductive adhesive is provided between the first mating surface and the second mating surface
Data Source
AI summary
An optical module (100) and an optical communication device. The optical module (100) comprises a first housing (110), a second housing (120), an optoelectronic component (130) and a circuit board (140). The optoelectronic component (130) and the circuit board (140) are both mounted between the first housing (110) and the second housing (120). A bottom wall (150) on the side of the first housing (110) facing the second housing (120) is provided with a first protrusion (111), the first protrusion (111) being provided with a first matching surface (112); and a bottom wall (150) of the second housing (120) is provided with a second matching surface (122), the first matching surface (112) being thermally connected to the second matching surface (122). Heat generated by the optoelectronic component (130) during operation can be conducted to the first housing (110) by means of the first protrusion (111), and heat concentrated on the second housing (120) can also be conducted to the first housing (110) by means of the first protrusion (111) and can be conducted to the outside by means of the bottom wall (150) of the first housing (110). Compared with a traditional air heat conduction method, the contact area between the first housing (110) and the second housing (120) is increased, such that the heat conduction rate is accelerated, and the heat concentrated on the second housing (120) can thus be quickly dissipated, thereby significantly improving the heat dissipation effect of the optical module (100).