Optical Module Heat Conduction Structure for Projection Device
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Solution Overview
Problem
Projection devices face challenges in heat dissipation due to the airtight nature of optical couplers, which prevents effective discharge of heat generated by optical elements, potentially leading to high temperatures.
Innovation Solution
An optical module with a heat conduction structure, including a support with a heat pipe or high thermal conductivity material, is integrated into the projection device to guide and dissipate heat generated by the phosphor disk and driving device, while maintaining airtightness to prevent foreign matter contamination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the optical coupler is made airtight to prevent foreign matter adhesion, then the reliability of the optical element is improved, but the heat dissipation capability deteriorates
Solution Approach 1:
The optical coupler is divided into a sealed optical chamber and an external heat dissipation structure. The heat conduction structure extends from inside the sealed chamber to the outside, separating the protection function (maintained by sealing) from the heat dissipation function (achieved through external structures like heat sinks or fins).
Solution Approach 2:
The heat conduction structure acts as an intermediary between the optical element inside the sealed chamber and the external environment. It provides a thermal pathway that allows heat to be conducted away from the optical element without requiring the chamber to be open, thus maintaining both sealing and heat dissipation.
2Temperature
If cooling elements are mounted inside the optical coupler to improve heat dissipation, then the temperature control is improved, but the device complexity increases
Solution Approach 1:
The heat dissipation function is extracted from the internal space of the optical coupler and implemented externally through heat conduction structures that extend outside the sealed chamber. This eliminates the need for complex internal cooling mechanisms like fans or pumps, reducing device complexity while maintaining effective heat dissipation.
3Temperature
If the space inside the optical coupler is used for mounting cooling elements, then the heat dissipation is improved, but the available space for optical elements is reduced
Solution Approach 1:
The heat dissipation structure extends from the internal space into the external dimension, utilizing space outside the optical coupler chamber. This dimensional extension allows heat dissipation components to be positioned externally, preserving the internal volume for optical elements while still providing effective cooling pathways.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces internal temperatures and enhances heat dissipation performance by providing dedicated heat paths and structures for heat exchange, improving the operational reliability of the projection device.
Implementation Method 1
The heat conduction structure is disposed on the support... effectively reduces internal temperatures and enhances heat dissipation performance by providing dedicated heat paths and structures for heat exchange
Implementation Method 2
An optical module with a heat conduction structure, including a support with a heat pipe or high thermal conductivity material
Data Source
AI summary
An optical module includes a base body, a driving device, a phosphor disk. The base body includes a base and a support. The support has a first end portion and a second end portion opposite to each other, and the first end portion is connected to the base. The driving device is disposed at the second end portion of the support. The phosphor disk is connected to the driving device, and the driving device is suitable for driving the phosphor disk to rotate. The heat conduction structure is disposed on the support.