Optical Module Heat Sink Mounting With Elastic Thermal Interface
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Solution Overview
Problem
The heat dissipation fins in optical modules easily detach from the base due to insufficient connection strength, leading to reduced heat dissipation performance and potential detachment under vibration or shock.
Innovation Solution
A heat dissipation structure with a base featuring pressing parts and a resilient heat dissipation layer that securely fixes the heat dissipation module, utilizing the elasticity of the layer to ensure a tight fit and enhance connection strength, allowing for stable assembly and reuse.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If traditional heat dissipation fins are used without additional fixing structures, then the device complexity is reduced, but the connection strength between fins and base is insufficient causing easy detachment
Solution Approach 1:
The pressing part is integrated into the base structure, combining the fixing function with the existing base geometry. This merging approach increases connection strength without adding separate complex fixing components, thus resolving the contradiction between strength and device complexity
Solution Approach 2:
The pressing part is pre-formed on the base during base manufacturing, creating a built-in fixing mechanism before assembly. This preliminary action ensures strong connection from the start without requiring additional complex assembly steps or components
2Reliability
If the heat dissipation module is tightly fixed to ensure stability, then the reliability is improved, but the ease of operation for assembly and disassembly deteriorates
Solution Approach 1:
The pressing part uses an elastic material that can dynamically deform during assembly to allow easy insertion, then maintains continuous pressing force to ensure stable fixation during operation. This dynamic behavior resolves the contradiction between ease of assembly and assembly stability
Solution Approach 2:
The elastic pressing part changes its physical state (deforms) during the assembly process, transitioning from a compliant state that allows easy insertion to a rigid state that provides stable fixation. This parameter change enables both easy assembly and reliable stability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The structure ensures robust attachment of the heat dissipation module to the base, improving heat dissipation efficiency by reducing interface thermal resistance and facilitating flexible assembly scenarios.
Implementation Method 1
a heat dissipation layer provided on the bottom plate along a length direction of the bottom plate... the heat dissipation layer is tightly fitted between the first plate and the bottom plate
Implementation Method 2
the pressing part cooperates with the limiting part to fix the heat dissipation module on the bottom plate, the heat dissipation module is pressed down, the first plate presses the heat dissipation layer, and the heat dissipation layer is tightly fitted
Data Source
AI summary
A heat dissipation structure of an optical module. A heat dissipation layer (200) is arranged on a bottom plate (110) of a base (100). Pressing parts (121) are arranged on two sides in the width direction of the bottom plate (110). A heat dissipation module (300) is used to press down to apply an acting force to the heat dissipation layer (200), such that a first plate body (310) of the heat dissipation module (300) presses the heat dissipation layer (200) to deform. The pressing parts (121) are closely fitted to the first plate body (310) by using the springback property of the heat dissipation layer (200). The pressing parts (121) tightly press a limiting part (3101) of the first plate body (310) to prevent the heat dissipation module (300) from moving in an accommodation cavity (130), thereby ensuring the assembly stability. The heat dissipation layer (200) can absorb flatness and deformation degree tolerances of the first plate body (310) and the bottom plate (110), such that interface thermal resistance can be reduced, thereby ensuring the heat dissipation performance. In addition, due to springback of the heat dissipation layer (200), the first plate body (310) is closely fitted to the pressing parts (121), such that the strength of connection between the heat dissipation module (300) and the base (100) is further enhanced.