Co-Packaged Optical Module Heat Spreader for High Bandwidth Loads
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Solution Overview
Problem
The increasing heat loads from optical modules in multi-chip modules pose a challenge for effective heat management, potentially harming components unless properly addressed.
Innovation Solution
A heat spreader made of thermally conductive material is structurally and thermally connected to the optoelectronic assembly, extending from the circuit board to dissipate heat generated by the optical modules, allowing for efficient heat transfer to a heat sink.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If optical modules are integrated into multi-chip modules with increasing bandwidth, then communication performance is improved, but heat load increases and threatens component reliability
Solution Approach 1:
The patent extracts the heat management function from the optical module assembly by introducing a dedicated heat spreader component. This heat spreader is thermally coupled to the optical module and conductively connected to the substrate, separating the heat dissipation pathway from the optical signal pathway and enabling independent optimization of both functions
Solution Approach 2:
The heat spreader acts as an intermediary thermal conduit between the optical module (heat source) and the substrate (heat sink). This intermediary component facilitates efficient heat transfer while maintaining electrical isolation and structural integrity, resolving the contradiction between high bandwidth operation and heat management
2Reliability
If heat is not properly managed in optical modules, then component reliability deteriorates, but adding heat management structures increases device complexity
Solution Approach 1:
The patent merges the heat spreader with the substrate structure by providing conductive thermal pathways through the substrate itself. This integration approach combines the heat dissipation function with the existing substrate, reducing the need for separate complex cooling structures while maintaining component reliability
Solution Approach 2:
The substrate serves multiple functions: it provides mechanical support for the optical module, electrical connections for signal transmission, and thermal pathways for heat dissipation. This multi-functionality reduces overall device complexity by eliminating the need for dedicated structures for each function
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively manages heat generated by optical modules, preventing damage to components and optimizing space usage by allowing for increased feature integration in multi-chip modules while enhancing heat transfer rates.
Implementation Method 1
The heat spreader is comprised of a thermally conductive material and comprises a second portion that is structurally connected to the first portion and a third portion that is thermally connected to the optoelectronics assemblage
Data Source
AI summary
An optical module includes an optoelectronic assembly and a heat spreader. The optoelectronic assembly includes a flat, rigid substrate, an array of electrical contacts positioned on a first portion of the substrate, and an optoelectronics assemblage that is electrically connected to the array of contacts and is positioned apart from the array of electrical contacts. The heat spreader is comprised of a thermally conductive material and comprises a second portion that is structurally connected to the first portion and a third portion that is thermally connected to the optoelectronics assemblage.