Optical Module Heat Spreader Layout for SiP and BOA Cooling
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Solution Overview
Problem
In optical modules combining silicon photonics (SiP) elements, semiconductor optical amplifiers (SOA), and booster optical amplifiers (BOA), the uniform heat diffusion required for efficient thermo electric cooler (TEC) operation is hindered by the same thickness of heat spreaders used for all elements, leading to inadequate heat dissipation in components with higher heat generation rates.
Innovation Solution
The implementation of a configuration where the heat spreaders have varying thicknesses, with a first heat spreader of constant thickness for the SiP element and a second heat spreader with a smaller surface area attached to the first, allowing the BOA and SOA to have increased thickness for improved heat diffusion, ensuring appropriate heat spreader thickness for each element.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the same thickness heat spreader is used for all elements (SiP, SOA, BOA), then the manufacturing complexity is reduced and cost is lowered, but the heat diffusion efficiency for high heat generation elements (SOA and BOA) becomes insufficient
Solution Approach 1:
The patent applies local quality by providing different thickness specifications for heat spreaders at different locations. The first heat spreader (first thickness) contacts the SiP element, while the second heat spreader (second thickness greater than first) contacts the BOA element. This allows each heat spreader to be optimized for its specific thermal requirements, with thicker heat spreaders used where higher heat generation occurs.
Solution Approach 2:
The patent segments the heat spreader system into multiple independent heat spreaders with different thicknesses rather than using a single uniform heat spreader. The first heat spreader and second heat spreader are separately configured and attached to different elements, allowing independent optimization of thermal performance for each element type.
2Reliability
If the thickness of the heat spreader in contact with BOA is increased to improve heat diffusion, then the heat absorption efficiency in TEC is improved, but the structural uniformity and manufacturing simplicity are reduced
Solution Approach 1:
The patent implements local quality by specifying that the second heat spreader (contacting BOA) has a greater thickness than the first heat spreader (contacting SiP). This local variation in thickness is precisely where needed - at the high heat generation BOA location - while maintaining uniform thickness at locations with lower thermal demands.
Solution Approach 2:
The patent changes the thickness parameter of the heat spreader based on the thermal requirements of different elements. The thickness parameter is increased for the second heat spreader compared to the first, creating a gradient structure that optimizes heat diffusion where needed without unnecessarily complicating the overall device structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances heat absorption efficiency in the TEC, effectively managing temperature rise and ensuring sufficient heat dissipation for all elements, particularly those with higher heat generation rates like the BOA and SOA.
Implementation Method 1
heat of the SiP element, the SOA, and the BOA is diffused by the heat spreaders
Implementation Method 2
in order to cool the heating element at lower power consumption in a thermo electric cooler (TEC), it is effective to increase heat absorption efficiency in the TEC
Data Source
AI summary
An optical module according to the present disclosure includes: a first heat spreader having a first surface; a second heat spreader having a second surface having a smaller area than that of the first surface and being attached to the first heat spreader after the second surface and the first surface are in contact with each other; an optical processing circuit attached to the first heat spreader at a portion of the first surface that is not in contact with the second surface and configured to process and output light; and an optical amplifier attached to the second heat spreader at an opposite surface of the second surface and configured to amplify and output the light being output from the optical processing circuit.