Optical Module Heat Transfer Member and Insulating Region
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Solution Overview
Problem
The existing optical modules face challenges in quickly releasing and dispersing heat generated by control ICs and other components, leading to high temperatures in resin housings, which makes handling difficult and requires effective heat management to prevent local temperature increases.
Innovation Solution
The optical module incorporates a connector module with a circuit board, a metal housing, and a resin housing. A heat transfer member is positioned on the second surface of the circuit board, contacting the metal housing's first region, which is closer to the second surface, allowing for efficient heat conduction and dispersion to the resin housing while maintaining a controlled size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If heat transfer member contacts resin housing directly, then heat dissipation is improved, but local temperature increase occurs
Solution Approach 1:
The patent applies local quality by creating a thermally insulating region at a specific location between the heat transfer member and resin housing. This localized insulation prevents heat from concentrating in one area, allowing the heat transfer member to contact the resin housing for overall heat dissipation while the insulating region blocks direct heat transfer paths that would cause local temperature increases.
2Volume of moving object
If connector module size is reduced, then miniaturization is achieved, but heat dissipation capability deteriorates
Solution Approach 1:
The patent uses local quality by implementing a thermally insulating region at a specific location within the compact connector module structure. This allows the module to maintain a reduced overall size while the localized insulation strategically manages heat flow paths, enabling effective heat dissipation within the constrained miniaturized space.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables rapid heat release and dispersion from the connector module, effectively transferring heat to the resin housing without causing local temperature increases, thus improving handling safety and maintaining module miniaturization.
Implementation Method 1
A heat transfer member 7 is disposed on the second surface 3b... The plate member 10e includes a first region 10c overlapping the heat transfer member 7 in plan view and a second region 10d positioned around the first region 10c... The first region 10c is closer than the second region 10d to the second surface 3b and contacts the heat transfer member 7
Implementation Method 2
A thermally insulating region is provided between the first region and the resin housing
Data Source
AI summary
This optical module includes a cable including an optical fiber, and a connector module. The connector module includes: a circuit board having a first surface and a second surface; a metal housing in which the circuit board is disposed and which includes a plate-shaped portion facing the second surface; a resin housing in which the metal housing is disposed; and a heat transfer member which is disposed on the second surface. The plate-shaped portion of the metal housing includes a first region overlapping with the heat transfer member in plan view, and a second region located around the first region. The first region is closer to the second surface than the second region, and is in contact with the heat transfer member. A heat insulating region is disposed between the first region and the resin housing.