Pluggable Optical Module Heatsink Clip for Dense PCB Layouts
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Solution Overview
Problem
Existing POM cooling systems require significant PCB space for shoulder screws and coil springs, limiting port count density and failing to provide independent control over contact forces on the primary and secondary sides, which can be undesirable for varying heat transfer paths.
Innovation Solution
A small footprint heatsink attachment using pins and a Z-shaped spring clip to provide independent contact force to the secondary side heatsink, reaching through the PCB and into the primary side POM cage, allowing for fine adjustment of contact force and minimizing PCB space usage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If shoulder screws and coil springs are used to attach the secondary side heatsink, then the heatsink can be securely attached, but a significant amount of PCB space is required, limiting port count density
Solution Approach 1:
The attachment mechanism is segmented into independent components: pins attached to the PCB and a separate spring clip that engages with the pins. This segmentation allows the attachment mechanism to be distributed across multiple small points rather than requiring a large continuous area, thereby reducing the overall PCB space required while maintaining secure attachment through cumulative contact force from multiple pin-spring clips interfaces
Solution Approach 2:
The spring clip is designed to nest around multiple pins, with the pins positioned within the confines of the spring clip structure. This nesting arrangement allows the attachment mechanism to occupy minimal PCB space while the spring clip engages with multiple pins to provide secure, distributed attachment force across the heatsink interface
2Reliability
If shoulder screws and coil springs are used to attach the secondary side heatsink, then the heatsink can be securely attached, but the spring force is split equally between primary and secondary side heatsinks, reducing independent control
Solution Approach 1:
The attachment system is divided into independent segments: the primary side heatsink attachment and the secondary side heatsink attachment. Each side has its own dedicated pins and spring clips, allowing independent adjustment and control of contact force on each side. The spring clips on the secondary side engage with pins that are independently positioned and sized, enabling customized contact force distribution without affecting the primary side attachment
Solution Approach 2:
The pins and spring clips are configured with locally optimized properties: different pin lengths, diameters, and positions; different spring clip dimensions and material properties. This local customization allows each pin-spring clip interface to provide the specific contact force required for that location, enabling independent control of contact force on the secondary side heatsink while maintaining secure attachment
3Area of stationary object
If pins and Z-shaped spring clip are used to attach the secondary side heatsink, then PCB space is minimized and port count density is maximized, but the attachment mechanism must provide sufficient contact force
Solution Approach 1:
The contact force is segmented and distributed across multiple pin-spring clip interfaces rather than relying on a single large attachment mechanism. Each pin-spring clip interface provides a concentrated contact force, and the cumulative effect of multiple such interfaces achieves the total required attachment force while occupying minimal PCB space
Solution Approach 2:
The spring clips provide dynamic, elastic contact force that automatically adjusts to the heatsink interface requirements. The spring material and geometry are selected to provide the necessary contact force while accommodating thermal expansion and manufacturing tolerances, ensuring sufficient attachment force is maintained under varying operating conditions
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Maximizes port count density and allows for independent control of contact forces on the secondary side, reducing the impact of PCB thickness variations on heat transfer efficiency.
Implementation Method 1
a spring clip coupled to the plurality of pins and adapted to bias the secondary side heatsink towards a secondary side of the pluggable optical module
Implementation Method 2
a secondary side heatsink disposed on the secondary side of the printed circuit board and in thermal contact with the pluggable optical module
Data Source
AI summary
A heatsink assembly including a printed circuit board having a primary side and a secondary side, a pluggable optical module cage coupled to the primary side of the printed circuit board and adapted to receive a pluggable optical module on the primary side of the printed circuit board, a plurality of pins coupled to the printed circuit board and protruding from the secondary side of the printed circuit board, a secondary side heatsink disposed on the secondary side of the printed circuit board and in thermal contact with the pluggable optical module through openings defined in the printed circuit board and a secondary side of the pluggable optical module cage, and a spring clip coupled to the plurality of pins and adapted to bias the secondary side heatsink towards a secondary side of the pluggable optical module to promote the thermal contact between the secondary side heatsink and the pluggable optical module.