Co-Packaged Optical Module Heatsink Layout for Uneven Heat Loads
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Solution Overview
Problem
Existing optical transceiver products face challenges in reducing package footprint and increasing bandwidth, due to the side-by-side placement of components which consumes board area and introduces electrical loss, making it difficult to achieve high data rates beyond 400G.
Innovation Solution
A co-packaged optical-electrical module with a switch processor and multiple light engine chiplets mounted on a compact switch substrate, featuring an integrated heatsink for efficient thermal dissipation, allowing for a compact form factor while maintaining high performance and bandwidth.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If components are placed side-by-side on the substrate, then ease of manufacture is improved, but device area increases and electrical loss increases
Solution Approach 1:
The patent transitions from traditional side-by-side 2D component placement to a 3D stacked architecture where optical components and electrical components are vertically separated into different layers. The optical engine is mounted on an optical substrate in a first layer, while electrical components are mounted on an electrical substrate in a second layer, enabling compact integration without increasing lateral footprint.
Solution Approach 2:
The patent divides the system into distinct functional modules: an optical engine module containing optical components on an optical substrate, and an electrical module containing electrical components on an electrical substrate. This segmentation allows each module to be optimized independently and facilitates thermal management by separating heat-generating electrical components from sensitive optical components.
2Ease of manufacture
If components are placed side-by-side on the substrate, then ease of manufacture is improved, but electrical loss increases
Solution Approach 1:
By stacking electrical components vertically beneath the optical engine rather than placing them side-by-side, the patent dramatically reduces the length of electrical interconnects. The electrical substrate is positioned in direct thermal and electrical contact with the optical substrate, minimizing signal path length and reducing electrical loss while maintaining manufacturing feasibility.
3Ease of manufacture
If traditional optical transceiver design is used, then manufacturing simplicity is maintained, but bandwidth capacity is limited
Solution Approach 1:
The patent merges optical components and electrical components into a single integrated co-packaged module, achieving high bandwidth capacity through close proximity integration. The optical engine with multiple optical channels is directly coupled with electrical processing components, enabling data rates exceeding 400G while maintaining manufacturing simplicity through modular assembly procedures.
4Area of stationary object
If compact form factor is achieved through component integration, then device area is reduced, but thermal dissipation becomes more difficult
Solution Approach 1:
The patent segments the system into thermally independent zones by separating electrical components on the electrical substrate from optical components on the optical substrate. This segmentation allows dedicated thermal management paths: electrical components generate heat that can be dissipated through the electrical substrate and associated heat sinks, while optical components remain in a cooler environment, enabling compact integration without compromising thermal dissipation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The co-packaged module achieves high-performance benefits with efficient thermal dissipation, enabling desired bandwidth capacity for high-speed data communication applications, while reducing power consumption and interconnect loss.
Implementation Method 1
an integrated heatsink for efficient thermal dissipation
Implementation Method 2
efficient thermal dissipation
Data Source
AI summary
An optical communication system includes a co-packaged optical module and a heatsink mounted to the co-packaged optical module. The co-packaged optical module includes a processor disposed on a substrate and a plurality of light engines disposed at different locations around the processor on the substrate. The processor and the light engines generating different amounts of heat during operation. The heatsink includes a plurality of heat pipes non-uniformly distributed throughout the heatsink to remove the different amounts of heat generated at a location of the processor and respective locations of the different ones of the light engines.