Optical Module Housing Bonding Region Blocking

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Solution Overview

Problem

The challenge in miniaturizing integrated optical modules is the mixing of different bonding materials during assembly, which leads to bonding property deterioration and assembly failure, due to the outflow of one bonding material into the region where another is applied.

Innovation Solution

The design includes a housing with distinct bonding regions for different materials and a bonding material outflow blocking part, such as a laser marking, positioned between these regions to prevent mixing, with the blocking part extending in a direction intersecting with but not orthogonal to the incident optical signals, ensuring the first bonding material does not flow into the second bonding region.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If the loading part and optical multiplexer are disposed close to each other on the mounting surface to miniaturize the integrated optical module, then the module size is reduced, but bonding materials may mix and cause assembly failure

Engineering Contradiction:
Improvemodule sizeVSAvoidassembly success rate
Core Design Contradiction:
Volume of moving objectVSReliability

Solution Approach 1:

The mounting surface is segmented into distinct bonding regions separated by a blocking structure. The blocking structure divides the mounting surface into a first bonding region for the loading part and a second bonding region for the optical multiplexer, preventing mixing of different bonding materials while maintaining close proximity of components for miniaturization.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

A blocking structure acts as an intermediary element between the first and second bonding regions. This blocking structure, formed by laser marking or protrusions, serves as a physical barrier that prevents bonding material outflow and mixing, enabling reliable assembly of miniaturized components.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Reliability

If a blocking structure is provided to prevent bonding material outflow, then mixing of bonding materials is reduced, but the blocking effect may be insufficient due to gaps between the structure and housing wall

Engineering Contradiction:
Improvebonding material separationVSAvoidblocking effectiveness
Core Design Contradiction:
ReliabilityVSManufacturing precision

Solution Approach 1:

The blocking structure extends in a direction intersecting with but not orthogonal to the incident direction of optical signals, creating a three-dimensional blocking configuration. This angular orientation allows the blocking structure to effectively seal the bonding regions without creating gaps that would compromise blocking effectiveness.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The blocking structure is positioned specifically at the boundary between bonding regions where material outflow occurs. The structure's geometry and orientation are optimized locally at this critical interface to provide maximum blocking effectiveness while maintaining overall module miniaturization.

Inventive Principle:
Principle #3Local quality

3Device complexity

If the bonding surfaces of loading part and optical multiplexer are arranged non-overlapping between side walls, then assembly complexity is reduced, but the distance between bonding surfaces increases reducing compactness

Engineering Contradiction:
Improveassembly complexityVSAvoidmodule compactness
Core Design Contradiction:
Device complexityVSVolume of moving object

Solution Approach 1:

The bonding surfaces are arranged asymmetrically between the first and second side walls, with the loading part and optical multiplexer positioned at different locations along the incident direction. This asymmetric arrangement simplifies assembly by avoiding overlapping bonding operations while maintaining compact dimensions through optimized spatial distribution.

Inventive Principle:
Principle #4Asymmetry

Data Source

PatentUS20240319453A1Integrated optical module
Publication Date: 2024.09.26 MITSUBISHI ELECTRIC CORP
  • US20240319453A1 patent drawing
  • US20240319453A1 patent drawing
  • US20240319453A1 patent drawing

AI summary

A mounting surface of a housing of an integrated optical module includes a first bonding region to which a first bonding material for bonding a loading part on which a plurality of light emitting elements are loaded is to be applied, and a second bonding region to which a second bonding material for bonding an optical multiplexer is to be applied. On the mounting surface, a bonding material outflow blocking part for blocking bonding material outflow is provided between the first bonding region and the second bonding region. The bonding material outflow blocking part extends in a direction intersecting with but not orthogonal to an incident direction of an optical signal, and in advancement along the extending direction thereof, the distance from a side of a bonding surface of the loading part along the incident direction of the optical signal increases.