Optical Module Hybrid Cooling Layout for Housing Heat Dissipation
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Solution Overview
Problem
Conventional optical modules face challenges in optical power, space management, thermal management, and manufacturing yield, particularly in achieving high heat dissipation efficiency for high-speed optical communications.
Innovation Solution
The optical module incorporates a heat sink and a liquid cooling pipe, utilizing both air cooling and direct liquid cooling (DLC) to enhance heat dissipation efficiency, with the liquid cooling pipe coupled to the housing and configured for coolant flow, featuring a bending part closer to the optical port and pipe joints extending from the electrical port.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional air cooling is used, then the structure is simple, but the heat dissipation efficiency is insufficient for high-speed optical communications
Solution Approach 1:
The patent combines air cooling and liquid cooling systems into a hybrid cooling structure. The heat sink with fins provides air cooling, while the liquid cooling pipe embedded in the housing provides direct liquid cooling. This merging of two cooling methods achieves superior heat dissipation efficiency compared to conventional air cooling alone, reducing housing temperature from 70°C to approximately 50°C.
Solution Approach 2:
The patent introduces a liquid cooling system using a liquid cooling pipe filled with coolant. The liquid coolant circulates through the pipe to directly absorb heat from the housing, utilizing hydraulic principles for efficient heat transfer. This liquid cooling approach complements the air cooling system and significantly improves heat dissipation capability.
2Temperature
If liquid cooling pipe is added to enhance heat dissipation, then heat dissipation efficiency improves, but device complexity increases
Solution Approach 1:
The liquid cooling pipe is integrated with the existing heat sink structure, merging two cooling mechanisms into a unified system. The pipe is embedded within or coupled to the heat sink, allowing both air and liquid cooling to operate simultaneously without requiring completely separate systems, thus moderating the increase in device complexity.
Solution Approach 2:
The cooling system is designed to serve multiple functions: the heat sink provides air cooling for general heat dissipation, while the liquid cooling pipe provides targeted liquid cooling where needed. This multi-functional design allows the system to adapt to different thermal management requirements without adding excessive complexity.
3Temperature
If cooling components are added to reduce housing temperature, then thermal management improves, but space management becomes more difficult
Solution Approach 1:
The liquid cooling pipe is embedded within or integrated into the heat sink structure, creating a nested arrangement where one cooling component is housed within or alongside the other. This nesting approach allows the cooling system to occupy minimal additional space while still providing enhanced thermal management capability.
Solution Approach 2:
The cooling components are strategically positioned at locations where heat dissipation is most critical. The liquid cooling pipe is placed to contact or be near the heat-generating elements, while the heat sink fins are positioned to maximize air flow and heat dissipation. This localized optimization reduces the overall space required compared to uniform cooling approaches.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The combined air and liquid cooling system reduces the housing temperature from 70°C to approximately 50°C, enhancing heat dissipation efficiency and reducing manufacturing costs while maintaining component arrangement integrity.
Implementation Method 1
a heat sink 120 coupled to an outer surface 111 of the housing 110
Implementation Method 2
heat dissipation efficiency
Implementation Method 3
a liquid cooling pipe 130 coupled to the housing 110... configured for a liquid coolant to flow therein
Implementation Method 4
liquid coolant to flow therein
Data Source
AI summary
The present disclosure provides an optical module, including a housing, a heat sink, and a liquid cooling pipe. The heat sink is coupled to an outer surface of the housing. The liquid cooling pipe is coupled to the outer surface or an inner surface of the housing, the liquid cooling pipe has at least one pipe joint, and an opening of the at least one pipe joint is proximate to an electrical port of the optical module.


