Optical Module Thermal Insulation Space Design
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing optical modules face challenges in reducing the impact of heat generated by photoelectric conversion parts while maintaining assembly workability, as the thermal expansion differences between the lens block and ferrule can lead to variations in optical coupling and communication quality.
Innovation Solution
The optical module incorporates a circuit substrate with a thermal insulation space between the optical fiber holding member and the optical coupling member, where the optical coupling member is fixed with a heat conducting member and an adhesive, and a clip member with high thermal conductivity is used to support the optical fiber holding member, ensuring efficient heat dissipation and assembly efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If the ferrule is supported by the circuit substrate to improve assembly workability, then assembly workability is improved, but heat generated in the photoelectric conversion part concentrates on the lens block or ferrule causing thermal stress and optical coupling variation
Solution Approach 1:
A resin layer is introduced as an intermediary thermal insulation layer between the circuit substrate and the optical components (lens block and ferrule). This resin layer acts as a thermal barrier that prevents heat from the circuit substrate from concentrating on the lens block and ferrule, while still allowing the ferrule to be supported and assembled on the circuit substrate. The resin layer thus mediates between the conflicting requirements of assembly support and heat isolation.
2Loss of energy
If the lens block and ferrule are thermally connected to the circuit substrate for heat dissipation, then heat dissipation is improved, but different thermal expansion coefficients cause thermal stress and optical coupling variation
Solution Approach 1:
The resin layer serves as a thermal insulation intermediary that decouples the thermal paths between the circuit substrate and the optical components. This prevents direct thermal contact that would cause differential thermal expansion, while still allowing mechanical support and assembly. The resin layer thus protects the optical coupling precision from thermal stress caused by different thermal expansion coefficients.
Solution Approach 2:
The patent applies different thermal properties to different regions: the resin layer provides thermal insulation at the location of optical components to prevent thermal stress, while other regions of the circuit substrate can maintain normal thermal conduction for heat dissipation. This localized approach to thermal management allows heat dissipation in non-critical areas while protecting sensitive optical coupling areas from thermal effects.
3Volume of moving object
If the optical fiber holding member is positioned close to the circuit substrate for compact design, then module size is reduced, but heat from the photoelectric conversion part affects the optical fiber holding member
Solution Approach 1:
The resin layer acts as a thermal insulation barrier between the circuit substrate and the optical fiber holding member, allowing compact positioning without direct thermal contact. This intermediary layer blocks heat transfer from the photoelectric conversion part to the optical fiber holding member, enabling reduced module size while protecting the optical fiber from heat influence.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively reduces the influence of heat on photoelectric conversion parts, enhances assembly workability, and maintains stable optical coupling by preventing thermal stress on the bonding surface between the lens block and ferrule.
Implementation Method 1
the optical coupling member is fixed to the circuit substrate by an adhesive
Implementation Method 2
a thermal insulation space is formed between the optical fiber holding member and the second region
Implementation Method 3
the optical coupling member is fixed with a heat conducting member
Implementation Method 4
a clip member with high thermal conductivity is used to support the optical fiber holding member
Data Source
AI summary
An optical module (1) of the invention includes a circuit substrate (24) on which light receiving and emitting elements (52) are mounted, a connector component (54) for holding optical fibers (7), and a lens array component (55) which is fixed on the circuit substrate (24) and optically connects the optical fibers (7) to the light receiving and emitting elements (52) on the circuit substrate (24), and the circuit substrate (24) has a lens array mounting region (A1) in which the lens array component (55) is fixed and a connector component opposed region (A2) opposed to the connector component (54), and thermal insulation space is formed between the connector component (54) and the connector component opposed region (A2).