Optical Module Interposer Assembly for High-Speed Signal Integrity
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional electronic assemblies face challenges in achieving high-speed data signaling and power output due to long electrical paths and space occupancy on host circuit boards, which hinder signal integrity and performance in communication systems.
Innovation Solution
The electronic assembly incorporates an interposer assembly with compressible contacts and optical modules directly connected to an integrated circuit component, bypassing the host circuit board for high-speed data signals, and uses optical module compression members to ensure reliable electrical connections and heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If electrical signals are routed through the host circuit board between the socket connector and other components, then the system can be assembled using conventional methods, but the long electrical paths reduce electrical performance and occupy board space
Solution Approach 1:
The patent introduces an interposer assembly as an intermediary component between the socket connector and the host circuit board. This interposer provides direct electrical pathways that bypass the long trace routes on the host circuit board, thereby improving signal integrity and electrical performance while maintaining conventional assembly procedures. The interposer acts as a mediator that resolves the contradiction by providing an alternative electrical path without requiring changes to the overall system architecture or assembly process.
2Productivity
If more conductors are added to increase signal and power output, then higher data communication speeds are achieved, but the system size increases
Solution Approach 1:
The patent utilizes the vertical dimension by stacking multiple interposer assemblies and optical modules in a three-dimensional configuration. This allows multiple conductors and signal paths to be packed into a compact volume by arranging them in layers rather than spreading them out on a two-dimensional plane. The vertical stacking enables higher channel density and increased data communication capacity without proportionally increasing the horizontal footprint of the system.
Solution Approach 2:
The patent employs a nested configuration where optical modules are mounted on interposer assemblies, which are in turn mounted on the host circuit board. This nested arrangement allows multiple functional components to be integrated within a compact structure, maximizing the use of available space and enabling high conductor density without excessive system size growth.
3Reliability
If the number of conductors is increased to meet signal and power output requirements, then higher performance is achieved, but board space occupancy increases
Solution Approach 1:
The patent transitions from a two-dimensional layout to a three-dimensional stacked configuration, allowing multiple conductors to be arranged vertically across multiple layers. This dimensional change enables high-density conductor routing that delivers the required signal and power output while minimizing the horizontal board space occupied by the interposer assembly and associated components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances signal integrity and performance by reducing electrical paths, increasing channel density, and allowing for higher data communication speeds while maintaining compact system size.
Implementation Method 1
The interposer contacts are compressible. Each interposer contact has an upper mating interface and a lower mating interface. The lower mating interfaces of the interposer contacts are mated with the upper package contacts
Implementation Method 2
The interposer contacts are compressible
Implementation Method 3
Each optical module includes an optical module substrate having module contacts and an optical engine mounted to the optical module substrate electrically connected to the module contacts
Implementation Method 4
Each optical module includes at least one optical fiber terminated to the optical engine
Implementation Method 5
The electronic assembly includes optical module compression members coupled to the optical modules. The optical module compression members compress the compressible interposer contacts between the optical modules and the electronic package
Data Source
AI summary
An electronic assembly includes an electronic package including a package substrate and an integrated circuit component mounted to an upper surface. The electronic package includes upper package contacts electrically connected to the integrated circuit component. The electronic assembly includes an interposer assembly including an array of compressible interposer contacts each having upper and lower mating interfaces. The interposer assembly defining a separable interface. The electronic assembly includes optical modules coupled to the separable interface of the interposer assembly and having an optical module substrate having module contacts and an optical engine mounted to the optical module substrate electrically connected to the module contacts. The optical module is mounted to the interposer assembly such that the module contacts are electrically connected to the upper mating interfaces of the interposer contacts. Each optical module includes at least one optical fiber terminated to the optical engine.