Optical Module Laser Box Alignment with Thermal Expansion Matching
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Solution Overview
Problem
The silicon optical chip in optical modules lacks an integrated light-emitting unit, necessitating an external light source, and the positional relationship between the silicon optical chip and laser box is sensitive, affecting optical path stability.
Innovation Solution
The optical module integrates a laser box with an enclosed light-transmitting member and a base of similar thermal expansion coefficient to stabilize the silicon optical chip and laser box, providing a stable optical path and incorporating a Mach-Zehnder interferometer for power modulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the silicon optical chip and laser box are separately assembled without thermal expansion matching, then the assembly process is simple, but the optical path stability deteriorates due to positional sensitivity
Solution Approach 1:
The patent applies homogeneity by using a base material with thermal expansion coefficient matching both the silicon optical chip and laser box materials. This creates a homogeneous thermal expansion environment where all components expand and contract uniformly with temperature changes, preventing relative displacement and maintaining optical path stability without complicating the assembly process.
2Ease of manufacture
If the silicon optical chip uses external light source without integrated light-emitting unit, then the chip manufacturing is simplified, but the device complexity increases due to additional laser box assembly
Solution Approach 1:
The patent merges the laser box and silicon optical chip assembly onto a single matching-base material platform. By combining these separate components into an integrated assembly where the base material coordinates their thermal expansion, the system reduces overall complexity while maintaining the manufacturing simplicity of separate chip and laser box production.
3Productivity
If the optical module requires precise alignment between silicon optical chip and laser box, then the optical coupling efficiency is improved, but the manufacturing precision requirements increase
Solution Approach 1:
The patent changes the thermal expansion parameter of the base material to match both the silicon optical chip and laser box. This parameter modification ensures that all components maintain their relative positions across temperature variations, achieving high optical coupling efficiency without requiring excessively tight manufacturing precision tolerances.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution ensures efficient optical coupling and modulation, enhancing light transmission power and stability by aligning the silicon optical chip and laser box, facilitating high-power optical signal conversion.
Implementation Method 1
a base of similar thermal expansion coefficient to stabilise the silicon optical chip and laser box
Implementation Method 2
both signals are received at an optical modulator. Using the RF signal, the optical modulator modulates the optical signal (e.g., a continuous wave) to generate a modulated optical signal
Data Source
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AI summary
An optical module (200). A circuit board (300) of the optical module (200) is provided with an opening (301) passing through upper and lower surfacesto facilitate providing a laser box (500) in the opening (301). A silicon optical chip (400) is provided on the circuit board (300). The laser box (500) is provided in the opening (301) of the circuit board (300) and is located on a substrate (302), such that the silicon optical chip (400) and the laser box (500) are located at a same horizontal height. The relative positional relationship between the silicon optical chip (400) and the laser box (500) can implement light emission form a side surface of the laser box (500) and the reception of the light from the laser box (500) by a side surface of the silicon optical chip (400), thereby providing an external light source for the silicon optical chip (400).