Optical Module Laser Box Integration for Silicon Photonics
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Solution Overview
Problem
Silicon photonic chips in optical modules require an external light source due to silicon not being an ideal light-emitting material, complicating the integration of a light-emitting unit and affecting the efficiency of optical-to-electrical signal conversion.
Innovation Solution
An optical module design that includes a laser box with a laser chip and a fiber ribbon, where the laser box is electrically connected to the circuit board and provides light to a silicon photonic chip, facilitating the integration of a light source within the module without the need for external light sources.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If an external light source is used for the silicon photonic chip, then the optical-to-electrical signal conversion can be achieved, but the device complexity increases due to the need for separate light source integration
Solution Approach 1:
The patent merges the light source (laser chip) and the silicon photonic chip into a single integrated module. The laser chip is mounted on a substrate and electrically connected to the circuit board, while the silicon photonic chip is positioned adjacent to receive light directly from the laser chip through a coupling structure. This integration eliminates the need for separate external light sources and reduces overall device complexity.
2Ease of manufacture
If the laser box structure is implemented, then the light source integration is achieved, but the manufacturing precision requirements increase due to alignment constraints
Solution Approach 1:
The patent implements preliminary positioning structures during manufacturing, including positioning holes in the substrate and corresponding positioning protrusions on the laser chip and silicon photonic chip. These pre-designed positioning features guide the alignment process and ensure precise positioning of the chips relative to each other, thereby reducing the actual manufacturing precision requirements during assembly.
Solution Approach 2:
The substrate acts as an intermediary component that facilitates the connection between the laser chip and the silicon photonic chip. It provides a common mounting platform, electrical connection pathways, and mechanical support, thereby simplifying the integration process and reducing direct alignment constraints between the two active chips.
3Stability of the object's composition
If the laser box with upper cover and flat base is used, then the light source is stabilized, but the device complexity increases
Solution Approach 1:
The laser box structure is designed to perform multiple functions: the flat base provides mounting support for the laser chip and electrical connections, the upper cover protects the internal components and provides structural stability, and the side walls facilitate heat dissipation. By integrating these multiple functions into a single structural unit, the overall device complexity is minimized while achieving light source stabilization.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances the integration and efficiency of optical-to-electrical signal conversion by providing a stable internal light source for the silicon photonic chip, improving the module's performance and manufacturing simplicity.
Implementation Method 1
a laser chip attached on the conductive substrate and electrically connected to the conductive substrate; and an upper cover including a top plate and side plates connected to the top plate, with bottom portions of the side plates being connected to the flat base so that the upper cover caps the flat base
Implementation Method 2
a silicon photonic chip electrically connected to the circuit board and to the other end of the fiber ribbon, for receiving the light without carrying a signal transmitted by the fiber ribbon
Data Source
AI summary
An optical module includes: a circuit board with a recess; a laser box disposed in the recess and electrically connected to the circuit board; a fiber ribbon, wherein one end of the fiber ribbon is connected to the laser box; and a silicon photonic chip electrically connected to the circuit board and to the other end of the fiber ribbon. The laser box includes: a flat base disposed in the recess, with one end of the flat base being coupled to the fiber ribbon; a conductive substrate disposed at the other end of the flat base and electrically connected to the circuit board; a laser chip attached on the conductive substrate; and an upper cover including a top plate and side plates, so that the upper cover caps/is covered on the flat base. A fitting between the flat base and the upper cover facilitates assembly of the conductive substrate and the laser chip in the laser box.