Optical Module Lead Frame for P-Type N-Type Substrate Adaptability
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Solution Overview
Problem
The existing optical module designs require multiple lead frame models to accommodate different conductivity types of substrates, leading to increased complexity and reduced productivity due to the need for various packaging members and molds.
Innovation Solution
The optical module employs a common lead frame and driver IC configuration, allowing for flexible connection arrangements to support both p-type and n-type substrates, thereby reducing the number of packaging models and streamlining the production process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple lead frame models are used to accommodate different conductivity types of substrates, then both p-type and n-type substrates can be supported, but the number of packaging members and molds increases
Solution Approach 1:
The lead frame is designed with a universal structure that can accommodate both p-type and n-type substrates through flexible connection arrangements. The lead frame includes a body portion with a mounting surface and connection portions that can be configured to connect to different electrode arrangements (first electrode on laminated body, second electrode on substrate rear surface) depending on the substrate type, eliminating the need for separate lead frame models.
2Adaptability or versatility
If multiple lead frame models are used to accommodate different conductivity types of substrates, then both p-type and n-type substrates can be supported, but productivity decreases
Solution Approach 1:
The universal lead frame design allows a single model to serve both p-type and n-type substrates, streamlining the production process. The lead frame can be configured with different connection arrangements (direct connection or via connection portions) depending on the substrate type, but uses the same basic structure, thereby improving productivity by reducing the number of packaging members and molds needed.
3Reliability
If different connection arrangements are used for p-type and n-type substrates, then proper electrical connections can be established, but the number of lead frame models increases
Solution Approach 1:
The lead frame employs dynamic configuration capabilities where the same lead frame structure can be adapted to different connection arrangements based on the substrate type. For p-type substrates, the lead frame connects to the first electrode on the laminated body; for n-type substrates, it connects to the second electrode on the substrate rear surface. This dynamic adaptability within a single universal design maintains connection reliability while avoiding the need for multiple specialized models.
Data Source
AI summary
According to one embodiment, an optical module includes a light emitting device, a driver IC, a first lead, a ground lead, a second lead, an input lead, and a power supply voltage lead. A second electrode of the light emitting device is supplied with a voltage on a ground side from a second pad through the first lead. A first electrode is supplied with a voltage on a power supply side from the power supply voltage lead or from a first pad through the second lead.