Optical Module Lead Pin Staggered Arrangement
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Solution Overview
Problem
Existing optical modules face challenges in reducing the pitch size between lead pins while maintaining the ability to easily implement them on an electric substrate, as smaller housing sizes can lead to interference during the bending process.
Innovation Solution
The optical module features lead pins arranged in a staggered configuration along the height direction of the housing side wall, allowing for a smaller pitch without overlap, enabling easier implementation and increased density on the substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If lead pins are arranged in a single row extending from a surface perpendicular to the implementation surface, then the optical module can be easily implemented on an electric substrate, but the pitch size between lead pins cannot be reduced
Solution Approach 1:
The patent transitions from a single-row arrangement to a multi-row arrangement along the height direction of the side wall. This dimensional change allows lead pins to be distributed across multiple rows, reducing the pitch size between adjacent lead pins while maintaining ease of implementation through systematic organization.
Solution Approach 2:
The patent employs asymmetric arrangement where odd-numbered and even-numbered lead pins are positioned at different distances from a reference line. This asymmetric staggered configuration optimizes space utilization, reduces pitch size, and prevents overlap while maintaining manufacturability.
2Productivity
If housing size is reduced to accommodate more lead pins, then implementation density increases, but lead pins may interfere with each other during the bending process
Solution Approach 1:
The patent segments the lead pin arrangement into multiple rows along the height direction, with each row containing fewer lead pins. This segmentation reduces the density of lead pins in any single location, minimizing interference during bending while achieving high overall implementation density through the multi-row configuration.
Solution Approach 2:
By distributing lead pins across multiple rows in the height direction rather than concentrating them in a single row, the patent increases implementation density without causing interference during assembly. The staggered asymmetric positioning further ensures that lead pins from different rows do not overlap during the bending process.
Data Source
AI summary
An optical module includes: at least one optical element; a housing main body that houses therein the at least one optical element; and a plurality of lead pins that are provided to a side wall of the housing main body. Further, at least one of the lead pins is electrically connected to the at least one optical element, and the lead pins are lined up in a plurality of rows along a height direction of the side wall, and are arranged in such a manner that adjacent lead pins do not overlap each other in a top view.