Optical Module Lens Assembly for Chip Interference Reduction
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Solution Overview
Problem
Existing optical modules face challenges in efficiently transmitting and receiving light due to interference between light transmitting and probing chips, which affects alignment accuracy and compatibility with related products, especially as the size of driving chips increases.
Innovation Solution
The optical module employs a Chip On Board (COB) packaging scheme with separate lens assemblies for light transmitting and probing chips, allowing for adjustable placement and alignment to minimize interference, and includes reflecting faces and optic fiber insertion ports to optimize light paths, ensuring better impedance matching and compatibility.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If light transmitting chip and light probing chip are placed close together on the circuit board, then the module size is reduced, but mutual interference between the chips increases affecting alignment accuracy
Solution Approach 1:
The patent introduces a vertical dimension by placing the light transmitting chip and light probing chip on opposite sides of the circuit board (one on the front surface, one on the back surface). This spatial separation in the vertical dimension reduces mutual interference between the chips while maintaining compact module size, thereby preserving alignment accuracy without increasing horizontal footprint.
2Power
If driving chips are made larger to improve performance, then the light transmission and reception capability is enhanced, but the compatibility with existing products is reduced
Solution Approach 1:
The patent segments the optical module into separate functional units: light transmitting chip, light probing chip, and their respective driving chips, placed on opposite sides of the circuit board. This segmentation allows each component to be optimized independently for high performance while the overall modular architecture maintains compatibility with existing product form factors and interfaces.
3Manufacturing precision
If separate lens assemblies are used for light transmitting and probing chips, then alignment accuracy is improved, but the device complexity increases
Solution Approach 1:
The patent combines the lens assemblies for the light transmitting chip and light probing chip into a single integrated lens assembly structure. This merged design simplifies the overall device complexity by reducing the number of separate components while still providing the necessary alignment accuracy through the coordinated positioning of lenses for both chips on opposite sides of the circuit board.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances light transmission and reception efficiency by reducing mutual interference between chips, improving alignment accuracy, and maintaining compatibility with related products even as driving chip sizes increase, thereby optimizing optical coupling and module performance.
Implementation Method 1
the lens assembly includes a reflecting face and an optic fiber insertion port; wherein the light transmitted by the light transmitting chip is reflected by the reflecting face to the optic fiber insertion port
Data Source
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AI summary
The application provides an optical module that includes a circuit board, a first chip, a second chip, and a lens assembly, wherein the first chip and the second chip are arranged respectively on the surface of the circuit board, and the lens assembly is arranged above the first chip and the second chip; the lens assembly includes a first optic fiber insertion port, a second optic fiber insertion port, a first reflecting surface, and a second reflecting surface; the distance between the axis of the first optic fiber insertion port, and the axis of the second optic fiber insertion port is less than the distance between the first chip and the second chip; and the first reflecting surface faces the first chip, the first reflecting surface faces the second reflecting surface, and the second reflecting surface faces the first optic fiber insertion port.