Optical Module Lid Guiding Structures for Compact Assembly

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Solution Overview

Problem

Existing optical modules face challenges in reducing dimensions and weight without compromising manufacturing yield, often requiring increased precision that can lead to decreased yield.

Innovation Solution

The optical module design includes a carrier with a light source and detector encapsulated by a molding compound featuring guiding structures, and a lid that surrounds and separates the light source and detector, allowing for reduced dimensions while minimizing the risk of damage during assembly.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If the dimensions and weight of optical modules are reduced, then the portability and integration density are improved, but the manufacturing precision requirements increase leading to decreased manufacturing yield

Engineering Contradiction:

Improveoptical module dimensionsVSAvoidmanufacturing precision

Core Design Contradiction:

Volume of moving objectVSManufacturing precision

Solution Approach 1:

The patent introduces a molding compound as an intermediary material that encapsulates the light source and light detector. This molding compound serves as a buffer and positioning medium, allowing the components to be held in precise relative positions without requiring extremely tight tolerances in the component manufacturing itself. The molding compound fills the space between components, providing mechanical support and optical guidance while accommodating minor dimensional variations.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The light source and light detector are disposed adjacent to the carrier surface and encapsulated by the molding compound before final assembly. This preliminary arrangement establishes the optical path and mechanical relationships early in the manufacturing process, allowing subsequent steps to focus on enclosing and protecting the already-positioned components rather than requiring precise positioning during final assembly.

Inventive Principle:

Principle #10Preliminary action

2Volume of moving object

If the dimensions and weight of optical modules are reduced, then the integration density is improved, but the risk of damage during assembly increases

Engineering Contradiction:

Improveoptical module dimensionsVSAvoidassembly risk

Core Design Contradiction:

Volume of moving objectVSReliability

Solution Approach 1:

The molding compound acts as a cushioning medium that surrounds and protects the light source and light detector during assembly operations. This encapsulation provides mechanical protection against impacts and stresses that could damage the fragile optical components, especially important when working with reduced-size modules where components are more vulnerable to handling damage.

Inventive Principle:

Principle #11Beforehand cushioning (Prior cushioning)

Solution Approach 2:

The patent implements a nested structure where the light source and light detector are enclosed within the molding compound, which is in turn enclosed by the lid. This nested arrangement protects the sensitive internal components from external damage while maintaining a compact overall structure. The lid surrounds and protects the encapsulated components, creating multiple protective layers.

Inventive Principle:

Principle #7Nested doll (Nesting)

3Manufacturing precision

If the precision requirements are increased to achieve smaller dimensions, then the component density is improved, but the manufacturing yield decreases

Engineering Contradiction:

Improvecomponent placement precisionVSAvoidmanufacturing yield

Core Design Contradiction:

Manufacturing precisionVSProductivity

Solution Approach 1:

The patent changes the approach to precision by transitioning from requiring precise component-to-component positioning to using the molding compound as a reference frame. Instead of demanding tight tolerances on individual component dimensions and positions, the design allows components to be positioned relative to the carrier surface and then encapsulated, changing the precision parameter from inter-component spacing to component-to-carrier positioning.

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The molding compound serves as an intermediary that absorbs and compensates for positioning variations. By providing a forgiving encapsulation medium, it allows broader tolerances in component placement while still achieving the desired optical performance and compact dimensions, thereby maintaining manufacturing yield.

Inventive Principle:

Principle #24Intermediary (Mediator)

Data Source

PatentUS10508935B2Optical module and manufacturing process thereof

Publication Date: 2019.12.17 ADVANCED SEMICON ENG INC

AI summary

The present disclosure provides an optical module and a manufacturing process thereof. The optical module includes a carrier, a light source, a light detector, a molding compound and a lid. The light source is disposed adjacent to a surface of the carrier. The light detector is disposed adjacent to the surface of the carrier. The molding compound encapsulates the light source and the light detector, and includes at least one guiding structure. The lid is disposed between the light source and the light detector, and surrounds the light source and the light detector.