Optical Module Lid With Lenses For 2D Fiber Arrangement
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Solution Overview
Problem
Conventional Wafer Level Packaging (WLP) methods for optical modules limit the flexibility of optical fiber arrangement to a one-dimensional configuration, restricting the advantages of on-board optics (OBO) processes such as reduced component costs, increased packaging density, and improved thermal management.
Innovation Solution
A novel optical module configuration featuring a lid with lenses that collimates light perpendicular to the substrate, allowing for two-dimensional flexibility in optical fiber connection, achieved through mounting light sources, reflection units, and optical waveguides on a semiconductor chip, which is then covered with a lid and cut into semiconductor chips.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional Wafer Level Packaging (WLP) methods are used for optical modules, then the manufacturing process is simplified, but the optical fiber arrangement is limited to one-dimensional configuration
Solution Approach 1:
The patent introduces a lid structure with vertical positioning that enables optical fibers to connect to the end face of the semiconductor chip in a direction substantially perpendicular to the chip surface. This adds a vertical dimension to the optical fiber arrangement, transforming the limited one-dimensional planar configuration into a two-dimensional arrangement that includes both lateral and vertical positions, thereby resolving the contradiction between manufacturing simplicity and arrangement flexibility.
2Quantity of substance
If components are two-dimensionally arranged on the mounting substrate in OBO process, then packaging density is increased, but optical fiber connection flexibility is restricted by conventional WLP methods
Solution Approach 1:
By enabling optical fibers to connect to the end face of the semiconductor chip perpendicular to the chip surface through the lid structure, the patent allows optical fibers to be arranged in both lateral and vertical directions. This two-dimensional arrangement capability complements the two-dimensional component layout on the mounting substrate, maximizing packaging density while maintaining full connection flexibility.
3Device complexity
If optical fibers are connected only at the end face of the semiconductor chip, then the connection structure is simplified, but the arrangement flexibility is limited to one dimension
Solution Approach 1:
The patent segments the optical fiber connection function into two parts: the lid structure that positions and guides optical fibers vertically, and the semiconductor chip end face that provides the optical interface. This segmentation allows the connection structure to remain simple while achieving two-dimensional arrangement flexibility through the combined lateral and vertical positioning capabilities.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration maximizes the flexibility of optical module arrangement on a mounting substrate, enhancing the advantages of the OBO process by enabling two-dimensional optical fiber connections and improving packaging density and thermal management.
Implementation Method 1
A novel optical module configuration featuring a lid with lenses that collimates light perpendicular to the substrate
Implementation Method 2
one or more light reflection units that changes a direction of travel of the light to a direction substantially perpendicular to the substrate
Data Source
AI summary
An optical module includes: a substrate; one or more light sources that produce light that is an optical signal; one or more light reflection units that change the direction of travel of the light to a direction substantially perpendicular to the substrate; one or more optical waveguides that optically connect the one or more light sources and the one or more light reflection units to each other; and a lid that is attached to the substrate to cover the one or more light sources, the one or more light reflection units and the one or more optical waveguides. The lid has one or more lenses that collimate light directed by the one or more light reflection units and transmit the light to the outside of the lid.