Optical Detection Module Light Shielding for Accurate CSP Sensing
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Solution Overview
Problem
Conventional optical detection modules using chip scale package technology face inaccuracies due to ambient light interference through the lateral surface of the glass substrate, leading to incorrect detection results.
Innovation Solution
A manufacturing method that involves spacing chip scale package assemblies on a carrier, filling light-sheltering material between them, removing the carrier, and trimming the material to form light-sheltering layers attached to the glass substrates, which block ambient light and enhance detection accuracy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If chip scale package assemblies are disposed on a carrier without light sheltering, then the manufacturing process is simple and efficient, but ambient light interferes with the detection chip causing inaccurate detection results
Solution Approach 1:
The patent divides the light sheltering function into separate layers (first light sheltering layer on the glass substrate, second light sheltering layer on the detection chip) rather than using a single complex sheltering structure. This segmentation allows each layer to independently block light from different directions, improving detection accuracy while maintaining manufacturing simplicity
Solution Approach 2:
The patent introduces a light sheltering layer as an intermediary substance between the ambient environment and the detection chip. This intermediary blocks harmful ambient light from reaching the detection chip's photosensitive areas, thereby improving measurement precision without significantly complicating the overall device structure
2Object-affected harmful factors
If light sheltering material is filled between adjacent chip scale package assemblies, then light leakage is prevented, but the manufacturing process becomes more complex
Solution Approach 1:
The patent combines the light sheltering function with the existing chip scale package assembly structure by integrating light sheltering layers directly onto the glass substrate and detection chip. This merging approach eliminates the need for separate light sheltering components between assemblies, preventing light leakage while maintaining manufacturing ease
Solution Approach 2:
The light sheltering layers are applied in advance during the manufacturing process - the first layer is formed on the glass substrate before assembling the detection chip, and the second layer is formed on the detection chip. This preliminary action ensures light blocking capability is built-in from the start, preventing light interference without requiring additional complex manufacturing steps later
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents light leakage, improving the detection efficiency of optical detection modules by ensuring that the imaging area of the detection chip can distinguish optical signals from ambient light, resulting in more accurate results.
Implementation Method 1
filling light sheltering material into a gap formed between two adjacent chip scale package assemblies... trimming the light sheltering material in the middle to form two light sheltering layers attached to the two adjacent chip scale package assemblies respectively, so that the two adjacent chip scale package assemblies with its own light sheltering layers respectively are separated to set as two optical detection modules
Data Source
AI summary
An optical detection module and a related manufacturing method are applied for chip scale package technology. The optical detection module includes a chip scale package assembly and a light sheltering layer. The chip scale package assembly includes a glass substrate, a detection chip, an isolation layer, a plurality of redistribution layers, and a plurality of conductive contacts. The detection chip is located above the glass substrate. The isolation layer is disposed on a surface of the detection chip opposite to the glass substrate. The plurality of redistribution layers is disposed on the isolation layer and spaced from each other, and having a plurality of conductive units. The plurality of conductive contacts is respectively disposed on the plurality of conductive units. The light sheltering layer is disposed on a lateral surface of the chip scale package assembly, and adapted to block light transmission and provide a covering protection function.