Optical Module Liquid Cooling Plate for High Power Density Heat Dissipation
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Solution Overview
Problem
Existing technologies fail to efficiently address the thermal management challenges posed by the high power density and power density variations in semiconductor devices, particularly in the context of advanced power devices, leading to inefficient thermal management and reliability issues.
Innovation Solution
A semiconductor device with a semiconductor device with a semiconductor device incorporating a liquid cooling structure, featuring a heat dissipation plate with coolant input and output ports, and a heat conduction layer for efficient heat transfer from the heat generating assembly to the heat dissipation plate, utilizing a coolant flow path for enhanced thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If air cooling is used for heat dissipation in optical modules, then the device structure is simple, but the heat dissipation capacity is insufficient for high-power light sources
Solution Approach 1:
The patent transitions from air cooling to liquid cooling by introducing a coolant flow path through the heat dissipation plate. The coolant (liquid) circulates through channels in the heat dissipation plate, absorbing heat from high-power light sources more efficiently than air cooling, while maintaining a relatively compact structure suitable for optical modules.
Solution Approach 2:
The patent changes the thermal management parameter from air-based convection to liquid-based convection, significantly improving heat transfer efficiency. The coolant flow path design allows for controlled heat removal, enabling the system to handle higher power densities while maintaining acceptable structural complexity.
2Reliability
If liquid cooling is implemented to increase heat dissipation capacity, then thermal management improves, but device complexity increases
Solution Approach 1:
The patent integrates the cooling function directly into the optical module structure by incorporating the heat dissipation plate with internal coolant channels as part of the module assembly. This merging of cooling functionality with the existing module structure improves thermal management reliability without proportionally increasing overall device complexity.
Solution Approach 2:
The heat dissipation plate serves as an intermediary component that transfers heat from the high-power light sources to the circulating coolant. This mediator approach allows effective thermal management while keeping the cooling system modular and manageable, balancing reliability improvement with controlled complexity increase.
3Power
If higher power density is achieved in optical modules, then switching capacity increases, but heat dissipation becomes more difficult
Solution Approach 1:
The patent employs liquid cooling through internal coolant channels to efficiently remove heat generated by high-power density components. The liquid coolant provides superior heat transfer capability compared to air cooling, enabling the optical module to sustain higher power densities without compromising heat dissipation efficiency.
Solution Approach 2:
The patent changes the heat transfer medium from gas to liquid, fundamentally improving the heat dissipation parameter. This parameter change allows the system to handle higher power densities by increasing the heat transfer coefficient, directly addressing the challenge of heat dissipation at elevated power levels.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The liquid cooling structure effectively addresses the thermal management challenges by providing superior heat dissipation capacity, enabling higher power density and reliability in semiconductor devices.
Implementation Method 1
a heat conduction layer, covering at least one of an upper surface or a lower surface of the heat dissipation plate, where the heat conduction layer is in contact with a heat generating assembly in the optical module to transfer heat from the heat generating assembly to the heat dissipation plate
Implementation Method 2
a coolant input port and a coolant output port, where the coolant input port and the coolant output port are in communication with an inner cavity of the heat dissipation plate to form a coolant flow path
Data Source
AI summary
A liquid cooling structure of an optical module, and an optical module are provided. The liquid cooling structure may include a heat dissipation plate, including: a heat dissipation plate, including a coolant input port and a coolant output port, where the coolant input port and the coolant output port are in communication with an inner cavity of the heat dissipation plate to form a coolant flow path; and a heat conduction layer, covering at least one of an upper surface or a lower surface of the heat dissipation plate, where the heat conduction layer is in contact with a heat generating assembly in the optical module to transfer heat from the heat generating assembly to the heat dissipation plate.