Optical Module Manufacturing Using Reflective Resin Grooves
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Solution Overview
Problem
The existing method for manufacturing semiconductor light emitting devices involves unnecessary sacrificial sheets and multiple dicing processes, increasing manufacturing costs and complicating the process.
Innovation Solution
A method that includes mounting a light emitting device on a board with electrodes, sealing with a light transmissive resin, forming a groove, filling with light reflective resin, and dicing along the reflective resin to reduce module height and size while simplifying the process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If sacrificial sheets are used in the manufacturing process, then the light emitting surface can be exposed after dicing, but the manufacturing cost increases due to unnecessary materials
Solution Approach 1:
The invention extracts and eliminates the sacrificial sheet from the manufacturing process. Instead of using a separate sacrificial sheet that must be attached and later removed, the patent uses the light transmissive resin itself as the final packaging material that remains in the product, thereby removing the unnecessary material step and reducing manufacturing cost.
Solution Approach 2:
The light transmissive resin serves multiple functions: it acts as both the packaging material covering the light emitting device and the final protective layer exposing the light emitting surface. This multi-functionality eliminates the need for separate sacrificial materials, reducing both cost and material waste.
2Ease of manufacture
If multiple dicing processes are performed to form grooves and cut resin packages, then the module can be separated and packaged, but the manufacturing process becomes complicated
Solution Approach 1:
The invention merges the groove formation and resin cutting steps into a single dicing operation. By performing both functions in one process step, the manufacturing process is simplified while still achieving the necessary separation and packaging of the light emitting device.
Solution Approach 2:
The light transmissive resin serves as both the packaging material and the material to be cut for separation. This multi-functionality allows a single dicing process to accomplish both groove formation and package separation, reducing process complexity.
3Length of stationary object
If the module height is reduced for compactness, then the size of the optical module decreases, but the manufacturing process may become more difficult
Solution Approach 1:
The invention changes the physical parameters of the resin packaging material to achieve reduced module height. By using a light transmissive resin that can be molded to thin profiles and serves multiple functions, the module achieves compact dimensions while maintaining ease of manufacture through the simplified single-step dicing process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces the height and size of the optical module while shortening the manufacturing process, eliminating the need for sacrificial sheets and minimizing dicing steps.
Implementation Method 1
sealing with a light transmissive resin
Implementation Method 2
filling with light reflective resin
Implementation Method 3
disposing a resin sheet containing a light conversion material so as to face the surface on which the light emitting device is mounted
Data Source
AI summary
A method includes mounting a light emitting device on a board having electrodes on its surface, disposing a resin sheet containing a light conversion material so as to face the surface of the board and filling a space between the resin sheet and the board with a first light transmissive resin, covering a surface of the resin sheet opposite to a surface of the resin sheet covered with the first light transmissive resin, with a second light transmissive resin, forming a groove extending from a top surface of the second light transmissive resin to the board, filling the groove with light reflective resin and covering the top surface of the second light transmissive resin with the light reflective resin, removing the light reflective resin, and dicing the light emitting device by cutting along the light reflective resin.