Optical Module Identifying Mark Inspection
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Solution Overview
Problem
Existing optical modules face challenges in distinguishing semiconductor chips after packaging, as identifying patterns on the top surface become unrecognizable, complicating production stability and traceability.
Innovation Solution
The optical device features a light-emitting facet with trenches and exposed identifying marks, such as grooves and patterns, that can be inspected from outside the package, allowing for chip identification and simplifying production processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If the identifying pattern is formed on the top surface of the device chip, then the chip can be identified during the assembling process, but the pattern becomes unrecognizable after the device chip is enclosed within the CAN package
Solution Approach 1:
The identifying mark is relocated from the top surface (two-dimensional plane) to the side surface of the device chip that remains visible through the lens in the packaged state. This dimensional relocation allows the mark to be inspected through the transparent lens after packaging, resolving the contradiction between identification need and packaging obscuration.
2Loss of information
If additional information or conversion tables are used to relate the device chip within the CAN package to the wafer process, then chip traceability can be maintained, but the management of the production becomes complicated
Solution Approach 1:
The device chip itself carries the identifying mark directly on its visible side surface, enabling self-identification without requiring external conversion tables or additional information systems. The mark serves its identification function directly through visual inspection, eliminating the need for complex data management systems.
3Reliability
If the optical device is enclosed in the CAN package, then the device is protected and assembled, but only the light-emitting facet can be viewed from the outside, limiting inspection capability
Solution Approach 1:
The transparent lens serves as an intermediary that allows visual inspection of the identifying mark on the device chip side surface while maintaining the protective enclosure of the CAN package. The lens mediates between the need for protection and the need for inspection capability.
Data Source
AI summary
An optical module is described, where the optical module installs an optical device whose identification mark is able to be distinguished even after the optical device is installed in the optical module. The identifying mark of the optical device is formed in a position able to be inspected from the direction of the normal line of the light-emitting facet of the optical device. Accordingly, the identifying mark becomes able to be identified through the lens after the optical device is installed in the package of the optical module.