Optical Module Thermal Management via Metal Plate
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Solution Overview
Problem
Conventional optical modules face challenges in heat dissipation due to inadequate transfer paths and low heat-dissipating efficiency, especially when optical devices are integrated in metal packages or directly mounted on boards, leading to reduced thermal conductivity and increased risk of optical component damage.
Innovation Solution
The optical module incorporates a board with through holes, a metal plate bonded to the board, and thermal-conductive members on the metal plate's surface to transmit heat generated by components to the housing, ensuring efficient heat dissipation through high thermal conductivity materials like copper alloys and precise positioning of optical components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If optical devices are mounted directly on a board without metal package protection, then the optical module can be downsized and communication speed can be increased, but the optical components are exposed without protection and require high positional precision which is difficult to maintain
Solution Approach 1:
The patent divides the optical module into distinct functional areas: a through-hole region for mounting optical components (lens, ferrule, optical waveguide) on the board, and a separate metal plate region for mounting electronic components. This segmentation allows optical components to be exposed for direct board mounting while maintaining their positional precision through the through-hole structure, resolving the contradiction between downsizing and protection/precision.
2Quantity of substance
If a sub-board is provided to mount additional electronic components, then the area for mounting components is increased, but the area between electronic components on the main board and the heatsink is blocked, making it difficult to form heat transfer paths
Solution Approach 1:
Instead of adding a sub-board that blocks heat paths in the planar dimension, the patent utilizes the vertical dimension by forming through-holes in the board. Heat-generating electronic components are mounted on the front surface while their heat transfer paths extend through the board thickness to the rear surface heatsink, enabling efficient heat dissipation without blocking areas. This dimensional transition resolves the contradiction between component quantity and heat dissipation.
3Temperature
If thermal-conductive gel is filled between electronic components on the board and the heatsink, then heat dissipation is improved, but the board's thermal conductivity is not high enough and heat is not dissipated quickly
Solution Approach 1:
The patent introduces a metal plate as an intermediary thermal conduction path between electronic components and the heatsink. The metal plate, having high thermal conductivity, is mounted on the rear surface of the board and thermally couples to electronic components through the board thickness, providing an efficient heat transfer pathway that overcomes the board's insufficient thermal conductivity. This intermediary structure resolves the contradiction between heat dissipation rate and board thermal conductivity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances heat-dissipating efficiency by establishing direct thermal paths from heat-generating components to the heatsink, reducing thermal resistance and maintaining optical component precision, thereby improving overall module performance.
Implementation Method 1
a thermal-conductive member that is arranged on another surface of the metal plate and transmits heat generated by the component to the housing
Data Source
AI summary
An optical module includes: a board that is accommodated in a housing and in which a through hole is formed; a metal plate that is bonded to an area of the board including the through hole; a component that is mounted on one surface of the metal plate and is arranged inside the through hole; and a thermal-conductive member that is arranged on another surface of the metal plate and transmits heat generated by the component to the housing.