Removable Optical Module Mounting Unit for High-Density Substrates
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Solution Overview
Problem
Conventional optical module mounting techniques on electronic substrates are non-removable, leading to high manufacturing costs, low yield ratios, and difficulties in upgrading or replacing individual modules, especially in high-density signal transmission systems, where defects or specification changes require replacing entire substrates, and existing solutions like MEG-Array connectors result in transmission loss and crosstalk issues.
Innovation Solution
A removable optical module mounting unit with a box-shaped housing and a pressing member that includes a thermal conductivity material, allowing for easy installation and removal of optical modules, reducing the need for soldering and enabling flexible module replacement, and utilizing a short electrical connection section to minimize transmission loss and crosstalk.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If optical modules are mounted on electronic substrates by bonding (soldering or conductive adhesive), then long-term reliability is guaranteed, but the optical modules become non-removable and manufacturing yield decreases
Solution Approach 1:
The invention divides the mounting system into three separable components: the electronic substrate, the optical module, and a dedicated mounting unit (socket). The mounting unit acts as an intermediary that connects to both the substrate and module through removable interfaces. This segmentation allows the module to be reliably mounted while maintaining removability, resolving the contradiction between reliability and manufacturing ease.
2Reliability
If optical modules are mounted by bonding, then reliability is improved, but the entire electronic substrate must be replaced when a module defects or needs upgrading
Solution Approach 1:
By introducing the mounting unit as a separate component between the substrate and optical module, the invention enables independent replacement of modules without affecting the substrate. The mounting unit remains on the substrate while modules can be individually removed and replaced, eliminating the need to replace entire substrates and reducing material loss.
Solution Approach 2:
The mounting unit serves as an intermediary component that facilitates the connection between the substrate and optical module. This mediator allows for easy module replacement while maintaining a stable connection to the substrate, solving the problem of substrate replacement loss when modules need to be upgraded or replaced.
3Ease of operation
If MEG-Array connectors are used to mount optical modules, then modules become removable, but transmission loss and crosstalk increase due to longer connection lengths
Solution Approach 1:
The invention changes the spatial arrangement of electrical connections by routing them through the vertical dimension via the mounting unit, rather than requiring long lateral connections through connectors. This dimensional change allows for short connection lengths while maintaining removability, reducing transmission loss and crosstalk.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution allows for improved yield ratios and cost reduction by enabling easy module replacement and reuse, reducing transmission losses, and facilitating miniaturization and high-speed signal transmission while maintaining module reliability.
Implementation Method 1
a pressing member that includes a thermal conductivity material
Data Source
AI summary
An optical module includes a module housing body including an electrical connection section for electrically connecting the electronic substrate and the optical module to each other and a housing section for housing the optical module, where the module housing body is mounted on the electronic substrate in such a manner that an electrical connection terminal of the electronic substrate and the electrical connection section is connected to each other and a fixing member for maintaining a state in which an electrical connection terminal of the optical module has contact with the electrical connection section in the module housing body. The optical module is housed in the housing section and is fixed in a removable manner by the fixing member, and the optical waveguide and the optical element are configured to be optically coupled to each other in a state in which the optical module is fixed.