Optical Module Cooling via Multi-Directional Heat Sink Contact
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing high-frequency connecting devices have poor heat dissipation efficiency due to limited thermal contact between optical modules and heat sinks, resulting in excessive thermal resistance and inefficient heat transfer.
Innovation Solution
A high-frequency connecting device with a stacked structure incorporating a housing, sandwiched member, inner heat sink, heat pipe, rear heat sink, and upper heat sink, where optical modules are directly in contact with multiple heat sinks through exposed contact portions, facilitating efficient heat transfer via a heat pipe network.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If only upper heat sinks are used for heat dissipation, then the structure is simple, but the heat dissipation efficiency is poor
Solution Approach 1:
The heat dissipation structure is segmented into multiple independent heat sinks (upper heat sink, lower heat sink, rear heat sink) positioned at different locations. Each heat sink independently contacts the optical module from different directions, dividing the heat dissipation function into multiple parallel paths to improve overall efficiency
Solution Approach 2:
The patent transitions from a single-direction (upper) heat dissipation approach to multi-dimensional heat dissipation by adding heat sinks in vertical (lower heat sink) and depth (rear heat sink) dimensions. This spatial expansion creates multiple thermal contact points, enabling heat to be dissipated from multiple directions simultaneously
2Reliability
If the pluggable mechanism is located inside the housing, then the connection is secure, but the optical module cannot make effective contact with the heat sinks
Solution Approach 1:
The pluggable mechanism is nested within the housing structure, with the optical module inserted through the housing to reach the connector. The heat sinks are strategically positioned around the insertion path, allowing the optical module to contact both the connector (for electrical connection) and the heat sinks (for thermal management) simultaneously during the same insertion action
Solution Approach 2:
The heat sinks are pre-positioned and fixed to the housing structure before the optical module is inserted. The upper heat sink is attached to the upper cover, the lower heat sink to the lower cover, and the rear heat sink to the rear wall, ensuring that thermal contact surfaces are ready and positioned correctly in advance to receive the optical module
3Device complexity
If existing thermal conduction methods are used, then the structure is conventional, but thermal resistance is excessive causing heat loss
Solution Approach 1:
The patent removes intermediate thermal interface materials and complex thermal conduction paths from the heat dissipation system. By using direct metal-to-metal contact between the optical module and the heat sinks through exposed contact portions, it extracts unnecessary thermal resistance layers, creating a simplified but highly efficient thermal conduction path
Solution Approach 2:
The patent provides excessive thermal contact by positioning multiple heat sinks (upper, lower, rear) that collectively offer more thermal contact area than minimally required. This redundant thermal contact ensures that even if one contact path has higher resistance, other paths compensate, guaranteeing low overall thermal resistance and minimizing heat loss
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration significantly reduces thermal resistance and enhances heat dissipation efficiency by ensuring direct contact between optical modules and multiple heat sinks, effectively transmitting high temperatures to the heat sinks for efficient cooling.
Implementation Method 1
The heat pipe is connected between the inner heat sink and the rear heat sink
Implementation Method 2
The top and the bottom of the first optical module are in direct contact respectively with the third contact portion and the first contact portion, while the top and the bottom of the second optical module are in direct contact respectively with the second contact portion and the fourth contact portion
Data Source
AI summary
A high-frequency connecting device includes a housing, a sandwiched member, an inner heat sink, a rear heat sink, a heat pipe, a upper heat sink and a connector. The inner heat sink is disposed inside the sandwiched member. The top and the bottom of the inner heat sink respectively have a first contact portion and a second contact portion. The upper heat sink has a third contact portion. A fourth contact portion is elastically disposed on the lower cover. The first and the second optical modules are respectively inserted into the upper and the lower spaces. The top and the bottom of the first optical module are in direct contact respectively with the third contact portion and the first contact portion, while the top and the bottom of the second optical module are in direct contact respectively with the second contact portion and the fourth contact portion.