Optical Module Wiring Substrate Layout Without Lead Pins
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Solution Overview
Problem
The existing optical modules are limited in downsizing due to the use of lead pins, which restrict the miniaturization of electronic devices, as the minimum size required for twenty lead pins with specific dimensions is approximately 15 mm, making further downsizing difficult.
Innovation Solution
The optical module design eliminates the need for lead pins by using a box-shaped housing with a bonded wiring substrate, where electric connections are made through a feedthrough and wiring substrate without lead pins, allowing for reduced dimensions such as a diameter of 0.1 mm and pitches of 0.15 mm, enabling increased design freedom and improved high-frequency characteristics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If lead pins are used for electrical connection, then connection reliability is improved, but module size increases to approximately 15 mm
Solution Approach 1:
The patent extracts and eliminates the lead pin component from the electrical connection system. Instead of using traditional lead pins that require a minimum module size of 15 mm, the invention uses a wiring substrate with conductive patterns that can be directly bonded to the housing, enabling downsizing to 3-4 mm while maintaining connection reliability through alternative bonding methods
Solution Approach 2:
The patent replaces the mechanical lead pin insertion and soldering system with a direct bonding system using wiring substrates. The conductive patterns on the wiring substrate are bonded directly to the housing, eliminating the need for mechanical lead pins and enabling significant size reduction while maintaining electrical connection reliability
2Reliability
If lead pins are used for electrical connection, then electrical conduction is achieved, but design freedom is restricted and high-frequency characteristics are degraded
Solution Approach 1:
The patent changes the electrical connection parameters by eliminating lead pins and using direct bonding of conductive patterns on wiring substrates. This enables smaller dimensions (0.1 mm diameter, 0.15 mm pitches) and improved high-frequency characteristics while maintaining reliable electrical conduction, thereby significantly increasing design freedom
Solution Approach 2:
The patent transitions from three-dimensional lead pin connections to two-dimensional conductive patterns on wiring substrates. This dimensional change allows for more flexible layout designs, better high-frequency performance, and increased design freedom while maintaining electrical connection reliability
Data Source
AI summary
An optical module includes a box-shaped housing with an optical element mounted therein. Further, a wiring substrate is bonded to a part of a surface of a housing part of the housing, and an electric wiring, which is formed in the wiring substrate or on a surface of the wiring substrate, and an electric wiring, which is introduced into the housing part or onto a surface of the housing part, are electrically connected to each other.