Optical Module Package Unit Integrating Light-Emitting and Sensor Chips
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Solution Overview
Problem
Conventional proximity optical sensor modules have high packaging costs due to separate packaging of light-emitting and light sensor chips, resulting in low luminous efficiency and reading instability in handheld devices.
Innovation Solution
An optical module package unit with a substrate, light-emitting and light sensor chips, a plastic lid with reflective and sensing holes, and adhesive members that encapsulate the chips, reducing packaging costs and enhancing luminous efficiency through die-attaching, wire-bonding, and metal coating.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If light-emitting chip and light sensor chip are separately packaged into individual packages, then packaging flexibility is improved, but packaging cost increases
Solution Approach 1:
The patent merges the packaging of light-emitting chip and light sensor chip into a single integrated package structure. The substrate integrates both chip mounting areas, the single package housing contains both chips, and the dome-shaped adhesive encapsulates both chips together. This integration eliminates the need for separate packaging processes while maintaining individual chip protection and functionality.
2Device complexity
If conventional separate packaging method is used, then packaging process simplicity is improved, but luminous efficiency decreases
Solution Approach 1:
The patent applies local quality optimization by creating a dome-shaped adhesive structure that specifically enhances the light path from the light-emitting chip through the adhesive to the light sensor chip. The dome shape is strategically positioned to focus and protect the light transmission path, improving luminous efficiency at the critical light interaction zone without complicating the overall packaging process.
3Reliability
If light sensor chip receives reflected light signal, then sensing function is improved, but reading stability deteriorates
Solution Approach 1:
The patent implements beforehand cushioning by using the dome-shaped adhesive structure to pre-protect the light path and light sensor chip from environmental variations. The adhesive encapsulation creates a stable optical environment before light signals are received, reducing the impact of external factors on reading stability while maintaining sensing functionality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Significantly lowers packaging costs and improves light-emitting and receiving performance, ensuring stable readings in handheld devices by integrating chips on a substrate and using a reflective layer and dome-like adhesive for enhanced luminous efficiency.
Implementation Method 1
The light-emitting hole comprises an annular reflective layer covered on the inside wall thereof that has an inner diameter increasing gradually in direction from the bottom side toward the top side thereof
Implementation Method 2
The two packaging adhesive structures are respectively molded in the first cavity and the second cavity on the substrate to encapsulate the light-emitting chip and the light sensor chip respectively, working as a protective layer for the light-emitting chip and a protective layer for the light sensor chip respectively
Data Source
AI summary
An optical module package unit includes a light-emitting chip and a light sensor chip respectively installed in a light-emitting zone and a light-sensing zone on a substrate, a lid of plastic shell integrally formed on the substrate and defining therein a first cavity and a second cavity around the light-emitting chip and the light sensor chip respectively, and two packaging adhesive structures respectively molded in the first cavity and the second cavity to encapsulate the light-emitting chip and the light sensor chip respectively. As the light-emitting chip and the light sensor chip are integrally packaged on the substrate, the packaging cost of the optical module is significantly lowered.