Optical Module Package Layout for Heat Dissipation and Signal Integrity
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Solution Overview
Problem
The increasing density of components in optical modules leads to heat-dissipation and high-frequency performance issues due to complex traces and conductive vias, which degrade signal quality and lower performance.
Innovation Solution
An optical module package structure with a housing and circuit board, incorporating a sub-board that electrically connects devices to the circuit board, allowing heat dissipation through a main heat-dissipation surface and reducing the need for conductive vias, thereby improving heat-dissipation and high-frequency performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the density of modules increases and more components are placed on the circuit board, then the functionality and channel capacity improve, but the complexity of traces and conductive vias increases, degrading signal quality and high-frequency performance
Solution Approach 1:
The patent divides the circuit board into multiple layers, with high-speed signal lines routed on the outer layer and power/ground lines on the inner layer. This segmentation allows independent optimization of signal integrity and power distribution, reducing interference and simplifying the overall trace design while supporting higher channel capacity
Solution Approach 2:
The patent transitions from planar 2D trace routing to 3D multi-layer routing by placing high-speed signals on the outer layer and using inner layers for power and ground. This dimensional change enables better signal quality and reduced via usage while maintaining high channel capacity
2Temperature
If high-speed signal lines are routed on the outer layer for better heat dissipation, then heat dissipation performance improves, but the complexity of conductive vias increases and signal quality degrades
Solution Approach 1:
The patent applies different routing strategies to different signal types: high-speed signals are routed on the outer layer with direct heat dissipation access, while power and ground lines are placed on inner layers. This local quality differentiation allows each signal type to be optimized for its specific requirements without compromising overall system performance
3Reliability
If the photoelectric chip is electrically connected to the high-speed signal line through wire-bonding, then electrical connection is achieved, but the heat sink must be arranged between the chip and the main heat-dissipation surface, reducing heat-dissipation speed
Solution Approach 1:
The patent extracts the wire-bonding connection from the traditional configuration and relocates it to the inner layer of the circuit board, separating the electrical connection function from the heat dissipation path. This allows the heat sink to be positioned directly against the main heat-dissipation surface without interference from wire-bonding structures, significantly improving heat dissipation speed
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances heat-dissipation efficiency and reduces the influence of conductive vias on high-frequency signals, improving trace space and overall module performance.
Implementation Method 1
The first device has a heat-dissipation surface, and the heat-dissipation surface faces and is thermally connected to the first housing
Data Source
AI summary
An optical module package structure, comprising a housing, and a circuit board, a first device, and a sub-board that are packaged in the housing. The housing comprises a first housing and a second housing. An outer surface of the first housing is a main heat-dissipation surface. The first device is electrically connected to the circuit board by means of the sub-board. A first signal line is provided on the circuit board. An extension section is provided on the sub-board. The sub-board partially overlaps the circuit board, and is connected to same. The first signal line extends to the extension section. The surfaces of the sub-board and the circuit board, partially overlapping each other, face opposite directions. The first device is electrically connected to the extension section. The first device is provided with a heat-dissipation surface. The heat-dissipation surface faces the first housing, and is thermally connected to same.