Optical Module Packaging Thermal Resistance Reduction
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Solution Overview
Problem
High-power photoelectric conversion modules face inefficiencies in heat dissipation due to air gaps or thermal conductive adhesives between the chip carrier and the housing, leading to increased thermal resistance and inconsistent product quality.
Innovation Solution
An optical module packaging structure with a metal chip carrier and housing that eliminates air gaps and thermal conductive paste, using a metal traversing plate and surrounding housing to form a continuous heat dissipation channel, along with fins and thermal conductive adhesives to enhance heat transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If air gaps or thermal conductive adhesives are used between chip carrier and housing, then assembly is easier, but thermal resistance increases and heat dissipation efficiency deteriorates
Solution Approach 1:
The chip carrier and housing are merged into a single integrated metal structure, eliminating the interface between separate components. This integration removes air gaps and the need for thermal conductive adhesives, creating a continuous heat transfer path from chips to housing, thereby reducing thermal resistance while maintaining manufacturing feasibility through integral forming processes
2Ease of manufacture
If chip carrier and housing are separated, then manufacturing is easier, but heat transfer channel is interrupted and heat dissipation efficiency deteriorates
Solution Approach 1:
The chip carrier and housing are combined into an integrated metal structure that provides a continuous, uninterrupted heat transfer channel. This integration ensures reliable and consistent heat dissipation from the chips through the housing, eliminating the thermal resistance and instability caused by separate components and their interfaces
3Device complexity
If traditional separate structure is used, then device complexity is lower, but sealing performance and cooling cannot be satisfied simultaneously
Solution Approach 1:
The chip carrier and housing are integrated into a single metal structure that simultaneously provides both sealing and cooling functions. The integrated design creates a sealed enclosure for the light path circuit while the metal structure itself serves as a heat dissipation pathway, achieving both sealing performance and effective cooling without increasing structural complexity
Solution Approach 2:
The integrated metal housing serves multiple functions: it provides structural enclosure for sealing the light path circuit, acts as a heat dissipation channel for cooling the chips, and maintains mechanical strength. This multi-functionality resolves the contradiction by making the same structure perform both sealing and cooling roles
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Significantly reduces thermal resistance, improves heat dissipation efficiency, and ensures reliable sealing and vibration resistance, addressing the bottleneck in traditional heat transfer channels.
Implementation Method 1
the surrounding housing, the traversing plate, and the chip carrier are integrally made of metal material... form a continuous heat dissipation channel... significantly reduces thermal resistance
Implementation Method 2
along with fins and thermal conductive adhesives to enhance heat transfer
Data Source
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AI summary
The invention discloses an optical module packaging structure, and further relates to an optical module, wherein the optical module packaging structure comprising a top cover, a bottom plate and an intermediate shell integrally formed of metal material; a cavity for receiving an electrical connector is opened on the bottom plate; the middle shell includes a surrounding housing, a traversing plate and a chip carrier; the traversing plate extends from the inner side of the left side wall of the surrounding housing to the inner side of the right side wall forming two strip-shaped mounting holes in relative positions along the extending direction; the chip carrier is positioned on the top surface of the traversing plate and is used for bearing chips that generate heat as the optical module is working. The invention provides a heat dissipation channel merely made of metal materials, so that the heat could be transferred to the housing through the heat dissipation channel without air gaps or thermal conductive paste and therefore the bottleneck caused by traditional heat transfer channel could be overcome by lowering the thermal resistance between the chips and the housing significantly. The cooling problem of optical module could be solved by this packaging structure.