Optical Module Heat Conduction Structure Using the Front Panel

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Solution Overview

Problem

Conventional heat dissipation methods for optical modules in communications devices are inefficient, resulting in poor heat dissipation effects, with temperature gains of only about 2°C.

Innovation Solution

A heat dissipation structure that utilizes a heat conduction module to conduct heat from the optical module to the existing panel, enhancing heat dissipation through conduction rather than air flow, and incorporates auxiliary heat dissipation components like heat pipes or holes to improve efficiency.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If heat dissipation holes are used for air convection, then heat dissipation is achieved, but the heat dissipation effect is poor with temperature gain of only about 2°C

Engineering Contradiction:

Improveheat dissipation effectVSAvoidheat dissipation efficiency

Core Design Contradiction:

TemperatureVSProductivity

Solution Approach 1:

The patent replaces the air convection system (mechanical fluid flow) with a heat conduction system using a heat conduction module. The heat conduction module directly conducts heat from the optical module to the panel, substituting the inefficient air flow mechanism with a more effective solid-state heat conduction path, thereby significantly improving heat dissipation efficiency and temperature control.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent introduces a heat conduction module as an intermediary component between the optical module and the panel. This intermediary facilitates efficient heat transfer by providing a dedicated thermal conduction path, acting as a mediator that bridges the heat source (optical module) and the heat sink (panel), thereby enhancing overall heat dissipation performance.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Temperature

If a dedicated heat dissipating device is disposed, then heat dissipation capability is enhanced, but device complexity increases

Engineering Contradiction:

Improveheat dissipation capabilityVSAvoidstructure complexity

Core Design Contradiction:

TemperatureVSDevice complexity

Solution Approach 1:

The patent makes the panel serve multiple functions: it acts as both the structural housing and the heat dissipation component. By integrating the heat dissipation function into the existing panel structure through the heat conduction module, the design eliminates the need for separate dedicated heat dissipation devices, thereby maintaining heat dissipation capability while reducing device complexity.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Solution Approach 2:

The patent merges the heat dissipation function with the existing panel structure by using the heat conduction module to conduct heat to the panel. This combination integrates what would traditionally be separate components (heat dissipation device and housing) into a unified structure, simplifying the overall device while maintaining effective heat dissipation.

Inventive Principle:

Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The proposed solution significantly improves heat dissipation efficiency, reducing thermal resistance and achieving lower temperatures compared to conventional methods.

Implementation Method 1

a heat conduction module configured to conduct, to the panel, heat emitted from the optical module, where one end of the heat conduction module is in contact with the optical module, and the other end of the heat conduction module is in contact with the panel

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentEP4086678B1Heat dissipation structure for optical module, and communication device

Publication Date: 2025.12.31 HUAWEI TECH CO LTD

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AI summary

This application provides a heat dissipation structure for an optical module (31) and a communications device, and relates to the field of optical communications technologies. The heat dissipation structure for the optical module (31) includes: a panel (1) with a jack; a PCB board (2), disposed on one side of the panel (1), where the PCB board (2) is configured to install the optical module (31); and a heat conduction module (4), configured to conduct, to the panel (1), heat emitted from the optical module (31), where one end of the heat conduction module (4) is in contact with the optical module (31), and the other end of the heat conduction module (4) is in contact with the panel (1). In the heat dissipation structure for the optical module (31) and the communications device, the panel (1) is mainly used to dissipate heat from the optical module (31).