Optical Module PCB Opening for Multi-Spec LiNbOx Modulators
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Solution Overview
Problem
The high cost and complexity of manufacturing 5G base stations due to the requirement of hermetically sealed structures and complex circuit layouts for electro-absorption modulated lasers (EML) in optical modules, coupled with the uncertainty of future optical module specifications, lead to significant investment risks in separate assembly lines for 800G DR8 and 2×400G FR4 modules.
Innovation Solution
An optical module configuration with a circuit board featuring an accommodation through opening that allows for the placement of various thin film LiNbOx modulators, supporting different optical module specifications, including 800G DR8 and 2×400G FR4, enabling the use of lower-cost continuous-wave lasers and reducing the need for separate assembly lines.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If hermetically sealed structures and complex circuit layouts are used for electro-absorption modulated lasers (EML), then transmission reliability is improved, but manufacturing cost and device complexity increase
Solution Approach 1:
The patent changes the modulator type from electro-absorption modulated laser (EML) to thin film lithium niobate (LiNbOx) modulator, which fundamentally alters the operating parameters and structural requirements. This parameter change allows for simplified circuit layouts and reduced manufacturing complexity while maintaining transmission reliability through the superior electro-optic properties of lithium niobate materials
2Manufacturing precision
If separate assembly lines are established for 800G DR8 and 2×400G FR4 modules, then manufacturing precision is improved, but productivity decreases and investment risk increases
Solution Approach 1:
The patent designs a universal circuit board structure with a standardized accommodation through opening that can accommodate different types of thin film LiNbOx modulators. This universal design enables a single assembly line to produce both 800G DR8 and 2×400G FR4 optical modules, eliminating the need for separate specialized assembly lines while maintaining manufacturing precision through standardized mounting procedures
Solution Approach 2:
The accommodation through opening is designed with dynamic adaptability, allowing the same physical opening to accommodate modulators of different specifications through adjustable positioning mechanisms. This dynamic design enables the assembly line to switch between different module types (800G DR8 and 2×400G FR4) without requiring dedicated fixtures for each specification, thereby improving productivity while maintaining precision
3Adaptability or versatility
If dedicated assembly lines are created for different optical module specifications, then adaptability to specific specifications is improved, but loss of time and investment risk increase
Solution Approach 1:
The standardized accommodation through opening design provides specification adaptability by allowing the same circuit board to accommodate various thin film LiNbOx modulator types. This universal approach eliminates the need for multiple dedicated assembly lines, reducing investment time and risk while maintaining the ability to adapt to different optical module specifications through software configuration and modular component selection
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables cost-effective production of optical modules with reduced manufacturing costs by allowing a single assembly line to produce both 800G DR8 and 2×400G FR4 modules, utilizing lower-cost continuous-wave lasers for long-distance and high-speed optical communication.
Implementation Method 1
a transmitter optical subassembly including a light emitting unit and a thin film lithium niobate (LiNbOx) modulator, wherein the thin film LiNbOx modulator is optically coupled with the light emitting unit
Data Source
AI summary
An optical module configuration includes a circuit board and a transmitter optical subassembly. The circuit board includes an accommodation through opening. The transmitter optical subassembly includes a light emitting unit and a thin film LiNbOx modulator. The thin film LiNbOx modulator is optically coupled with the light emitting unit, and the thin film LiNbOx modulator is disposed in the accommodation through opening. The accommodation through opening allows placement of various thin film LiNbOx modulators supportive of different optical module specifications.