Optical Module Plasmonic Waveguide Interconnect
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Solution Overview
Problem
Current three-dimensional optical circuit configurations face challenges in efficiently connecting optical waveguides on different substrates due to the complexity of fabricating grating couplers and mirrors, which limits operating wavelength and productivity, and complicates high-density packaging of multiple optical waveguide chips.
Innovation Solution
The optical module employs plasmonic waveguides formed with metal layers on substrates, using mode conversion and metal-metal joining to optically connect waveguides without limiting the operating wavelength, allowing for three-dimensional integration and high-density packaging.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a grating coupler is used for optical connection, then optical coupling between substrates is achieved, but fabrication complexity increases due to fine structure preparation and operating wavelength is limited
Solution Approach 1:
The patent introduces a plasmonic waveguide as an intermediary component between optical waveguides on different substrates. This plasmonic waveguide, formed with metal layers, serves as a mediator that enables optical coupling without requiring complex grating structures, thus simplifying fabrication while maintaining coupling effectiveness and removing wavelength limitations.
Solution Approach 2:
The patent changes the fundamental parameter of the coupling mechanism from dielectric-based grating structures to metal-based plasmonic structures. This parameter change enables broadband operation by exploiting the unique optical properties of metals at different wavelengths, removing the wavelength limitation inherent in grating couplers while simplifying the fabrication process.
2Reliability
If a mirror structure is used for optical connection, then optical coupling is achieved, but device complexity increases due to large three-dimensional structure preparation and productivity decreases
Solution Approach 1:
The patent replaces the mechanical mirror structure with a plasmonic waveguide system. Instead of using physical mirrors that require precise mechanical alignment and complex three-dimensional positioning, the invention uses electromagnetic field-based plasmonic coupling, which can be achieved through planar metal layer deposition and joining, significantly simplifying the process and improving productivity.
Solution Approach 2:
The plasmonic waveguide acts as an intermediary that eliminates the need for direct mirror-to-mirror coupling. The metal layers serve as mediators that enable optical energy transfer through controlled plasmonic interactions, replacing the complex mechanical mirror assembly with a simpler, more manufacturable structure.
3Reliability
If surface optical coupling is used, then optical connection is achieved, but packaging density decreases due to difficulty in high-density packaging of multiple chips
Solution Approach 1:
The patent transitions from surface-based optical coupling to edge-based coupling through vertical metal layer joining. By moving the coupling interface from a two-dimensional surface to a one-dimensional edge interface, the system enables three-dimensional chip stacking and higher-density packaging, as multiple chips can be vertically integrated with smaller lateral footprints.
Solution Approach 2:
The invention enables nested packaging arrangements where multiple optical waveguide chips can be stacked vertically or arranged in compact three-dimensional configurations. The edge-based plasmonic coupling allows chips to be nested or layered with minimal spacing, dramatically increasing packaging density compared to surface coupling methods.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration facilitates optical connections between substrates without wavelength limitations, enhancing productivity and enabling high-density packaging of multiple optical waveguide chips, while reducing alignment and reflection losses.
Implementation Method 1
a first plasmonic waveguide having one end formed of a first metal layer formed over an end portion of the first substrate, and having another end connected to one end of the first optical waveguide
Data Source
AI summary
An optical module according to the present invention includes: a first plasmonic waveguide having one end formed of a first metal layer formed over an end portion of a first substrate, and having another end connected to one end of a first optical waveguide; a second metal layer that is formed on a side surface continuous with the end portion of the first substrate and formed to be continuous with the first metal layer; a second substrate provided with a second plasmonic waveguide formed of a third metal layer; and a second optical waveguide that is connected to the second plasmonic waveguide and formed on the second substrate, wherein the second metal layer and a part of the third metal layer are joined together to connect the first substrate to the second substrate.