Integrated Optical Module for Single-Port Fiber and PoE Power
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Solution Overview
Problem
Existing optical communication devices, such as switches and APs, face challenges in miniaturization due to the need for separate optical and electrical ports for optical fiber and power connectors, which occupy significant panel space.
Innovation Solution
An integrated optical module that combines optical-to-electrical conversion and power transmission functions, allowing a single port for both optical signal and power transmission, reducing the need for separate electrical ports and facilitating miniaturization.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional optical module without EMI shielding is used, then the device complexity is reduced, but electromagnetic interference affects signal transmission stability
Solution Approach 1:
The EMI shielding structure is merged with the existing housing of the optical module, combining the protective function with the structural housing to reduce overall device complexity while maintaining EMI shielding effectiveness
Solution Approach 2:
The housing serves multiple functions: structural support, EMI shielding, and heat dissipation, eliminating the need for separate EMI shielding components and reducing device complexity
2Temperature
If heat dissipation fins are added to the housing, then heat dissipation performance is improved, but the device complexity increases
Solution Approach 1:
The heat dissipation fins are integrated directly into the housing structure, combining the thermal management function with the structural housing to avoid adding separate heat dissipation components
Solution Approach 2:
The housing simultaneously provides structural support, EMI shielding, and heat dissipation functions through the integrated fin design, reducing overall device complexity
3Length of moving object
If the optical module operates at high power, then transmission distance is extended, but electromagnetic interference and heat generation increase
Solution Approach 1:
The EMI generated by high-power operation is converted into a managed parameter by providing controlled EMI shielding that directs and contains the interference, while the heat generated is converted into manageable thermal energy through integrated heat dissipation fins
Solution Approach 2:
The housing acts as an intermediary structure that mediates between the high-power optical components and the external environment, providing EMI shielding and heat dissipation to manage the harmful effects of high-power operation
Data Source
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AI summary
An optical module, a communication device, and a PoE device are provided. The optical module includes a housing (1), an optical component (2), and a power supply component (3). The housing (1) is provided with a first socket (11) and a second socket (12). The optical component (2) includes a first optical connector (21), an optical-to-electrical conversion component (22), and a second optical connector (23) that are sequentially connected. The power supply component (3) includes a first electrical connector (31), a power supply line (32), and a second electrical connector (33) that are sequentially connected. Both the optical-to-electrical conversion component (22) and the power supply line (32) are located in the housing (1), the first optical connector (21) is located in the first socket (11), a part that is of the first electrical connector (31) and that is exposed from the housing (1) is located at any position at the first end of the housing (1); and both the second optical connector (23) and the first electrical connector (33) are located in the second socket (12). The first socket (11) is configured to insert a composite cable that matches the optical module. A power connector of the composite cable is electrically connected to the communication device by using the optical module, and the power connector of the composite cable does not need to be inserted into the communication device, so that panel space of the communication device can be reduced, and minimization development of the communication device is facilitated.