Optical Module Port for High-Speed Inter-Module Communication
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Solution Overview
Problem
The existing modular computing systems face a bottleneck in communication between modules due to the limitations of electrical communications buses, which cannot keep pace with the processing speed of the modules, leading to inefficiencies.
Innovation Solution
Implementing an optical communication system that allows direct communication between modules, bypassing the chassis-based communications bus, using modular ports with alignment devices and mechanisms to establish and maintain optical data buses for high-speed data transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If electrical communication bus is used for module communication, then system structure is simple and modules can be connected through chassis, but communication speed is limited and creates bottleneck between modules
Solution Approach 1:
The patent replaces electrical communication systems with optical communication systems. Specifically, electrical signals transmitted through copper traces on circuit boards are substituted with optical signals transmitted through optical fibers. This substitution enables communication speeds at the speed of light, eliminating the bottleneck created by electrical buses while maintaining system modularity and simplicity through standardized optical ports and alignment mechanisms.
2Productivity
If direct optical communication between modules is implemented, then communication bottleneck is reduced and data transfer speed increases, but system complexity increases due to additional alignment devices and optical components
Solution Approach 1:
The patent implements universal optical ports that can be integrated into various module types within the chassis system. These standardized ports include built-in alignment devices and optical connectors that work across different module configurations. This universality allows direct optical communication between any modules without requiring custom alignment mechanisms for each pair, thereby reducing overall system complexity while maintaining high data transfer efficiency.
Solution Approach 2:
The patent introduces optical coupling devices and alignment mechanisms as intermediaries between optical transmitters and receivers. These intermediary components facilitate precise alignment and efficient light coupling without requiring direct mechanical contact or complex adjustment mechanisms between modules. The optical couplers act as mediators that simplify the connection interface while enabling high-speed data transfer.
3Loss of time
If modules wait for information on communications bus, then electrical connection through chassis is sufficient, but processing speed of modules is underutilized due to waiting time
Solution Approach 1:
The patent replaces electrical signal transmission with optical signal transmission through optical fibers connecting modules directly. This substitution reduces signal transmission time to near the speed of light, eliminating the waiting time that occurs when modules queue for data transmission over electrical buses. The optical communication system enables parallel data transfer between multiple modules simultaneously, maximizing processor utilization and reducing idle waiting time.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution significantly reduces communication bottlenecks by enabling faster data transfer at the speed of light, allowing multiple channels of data to be transmitted efficiently between modules, thereby enhancing the overall performance of the computing system.
Implementation Method 1
An optical sender and an optical receiver may be attached to a first port 105. The optical sender and optical receiver may be used to transmit a data bus between the first module 100 and a second module 150.
Data Source
AI summary
A module includes a housing. The housing can include a port. The port can extend though an opening in the housing if the module is inserted in the chassis.