Optical Module Pressing Block with Positioning Angles

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Solution Overview

Problem

Conventional optical modules face challenges in assembly efficiency and cost due to the mismatch between round magnetic ring mounting holes and square isolator chips, leading to increased production costs and potential chip failure from misalignment and glue stress.

Innovation Solution

An optical module design featuring a metal front cover, ceramic sleeve, pressing block, and ceramic insertion core with a square chip accommodating hole and annular magnetic ring accommodating chamber, incorporating positioning angles to ensure accurate chip alignment and reduce glue usage.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If a round mounting hole is used in the magnetic ring, then the magnetic ring can be easily manufactured, but the isolator chip cannot be properly positioned and requires excessive glue

Engineering Contradiction:
Improvemagnetic ring manufacturingVSAvoidchip positioning accuracy
Core Design Contradiction:
Ease of manufactureVSManufacturing precision

Solution Approach 1:

The patent changes the mounting hole from a round shape to a square shape with positioning angles, creating an asymmetric structure that matches the square isolator chip. This asymmetric design enables precise positioning of the chip while reducing the need for corrective alignment and minimizing glue requirements.

Inventive Principle:
Principle #4Asymmetry

2Manufacturing precision

If multiple corrections are made during assembly, then the chip can be properly aligned, but the assembly efficiency decreases

Engineering Contradiction:
Improvechip alignment accuracyVSAvoidassembly efficiency
Core Design Contradiction:
Manufacturing precisionVSProductivity

Solution Approach 1:

The patent incorporates positioning angles directly into the square mounting hole structure during the magnetic ring manufacturing process. This preliminary action of pre-positioning the chip orientation eliminates the need for multiple corrective adjustments during assembly, thereby improving assembly efficiency while maintaining high positioning accuracy.

Inventive Principle:
Principle #10Preliminary action

3Reliability

If excessive glue is used to fill gaps, then the chip is securely fixed, but the production cost increases and chip reliability decreases

Engineering Contradiction:
Improvechip fixation stabilityVSAvoidproduction cost
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The square mounting hole with positioning angles creates a tight fit with the square isolator chip, minimizing gaps between the chip and mounting structure. This reduces the amount of glue needed for fixation, lowering production costs while maintaining secure chip attachment and avoiding stress-related reliability issues.

Inventive Principle:
Principle #4Asymmetry

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design enhances assembly accuracy, reduces production costs, and minimizes the area required for the isolator chip, improving coaxiality and reducing the risk of chip failure and glue overflow.

Implementation Method 1

The Faraday rotator 622 in a magnetic field can rotate the vibration surface of incident light by 45°

Methodology Applied
Scientific EffectFaraday effect: Faraday Effect

Data Source

PatentUS11531219B2Optical module having externally-mounted magnetic ring and chip positioning angle and pressing block structure thereof
Publication Date: 2022.12.20 XU JUN
  • US11531219B2 patent drawing
  • US11531219B2 patent drawing
  • US11531219B2 patent drawing

AI summary

An optical module having an externally-mounted magnetic ring and a chip positioning angle and a pressing block structure thereof are disclosed. The pressing block structure includes a pressing block. The pressing block includes a pressing block body. The pressing block body is provided with an insertion core positioning hole, a chip accommodating hole, and a magnetic ring accommodating chamber. The chip accommodating hole is provided with at least one positioning angle. The overall assembly accuracy of the optical module is improved, the material cost of the isolator chip is reduced, the positioning of the chip is more accurate, and the occurrence of glue overflow can be avoided.