Optical Module Package with Printed Shielding Layer
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Solution Overview
Problem
The existing optical proximity sensing module package structures are costly and hinder the reduction of device thickness due to the requirement of a thick lid and high material costs in the packaging process, which restricts the miniaturization of smart electronic devices.
Innovation Solution
A package structure for an optical module featuring a non-ceramic organic substrate with a frame defining light-emitting and light-admitting regions, encapsulated with transparent silica gel and shielded by an opaque plastic layer formed through printing or transfer printing, which includes light-emitting and light-admitting holes to reduce material usage and thickness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a lid is fixed to a dam and a partition board from above, then the package structure can enclose and protect the chips, but the material costs increase and the total package structure height increases
Solution Approach 1:
The patent removes the lid component from the package structure. Instead of using a traditional lid to enclose the chips, the invention uses an open frame structure with a shielding layer formed by printing or transfer printing that provides the necessary protection and light blocking functionality without requiring a separate lid component, thereby reducing material costs and simplifying the manufacturing process
Solution Approach 2:
The patent uses a shielding layer that is formed by printing or transfer printing to replicate the light-blocking function of a traditional lid. This printed shielding layer is applied to the frame and encapsulants, creating a cost-effective substitute that maintains the protective and optical shielding functions without requiring a thick, expensive lid component
2Reliability
If a lid is fixed to a dam and a partition board from above, then the package structure can enclose and protect the chips, but the total package structure height increases, restraining the extent of reduction
Solution Approach 1:
The patent removes the lid component that contributes significantly to package height. By eliminating the lid and using a planar shielding layer applied to the frame structure, the vertical dimension of the package is reduced, enabling thinner overall package structures while maintaining chip protection through the frame and encapsulant design
Solution Approach 2:
The patent employs a thin shielding layer formed by printing or transfer printing that provides the necessary light-blocking and protective functions in a minimal thickness. This thin-film approach replaces the thick lid structure, enabling significant reduction in total package height while maintaining the required protective functionality
3Ease of manufacture
If an opaque shielding layer is formed by printing or transfer printing, then packaging costs and total thickness are reduced, but light beam transmission must be precisely controlled
Solution Approach 1:
The patent applies the shielding layer with specific local properties - it is opaque in most areas to block light and provide shielding, but includes precisely positioned transparent regions or openings where light beam transmission is required. This localized differentiation of optical properties allows cost-effective printing/transfer printing while maintaining precise control over light beam paths for the optical sensing function
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively reduces packaging costs and total thickness while maintaining the functionality of the optical module by shielding the chips with an opaque shielding layer, minimizing light interference and maintaining light transmission efficiency.
Implementation Method 1
a shielding layer formed on the frame and the encapsulants and having a light-emitting hole and a light-admitting hole
Implementation Method 2
two encapsulants formed in the frame and enclosing the light-emitting chip and the light-admitting chip, respectively
Data Source
AI summary
A package structure of an optical module includes: a substrate having a frame defined with a light-emitting region and a light-admitting region; a light-emitting chip disposed at the light-emitting region of the substrate; a light-admitting chip disposed at the light-admitting region of the substrate; two encapsulants formed in the frame and enclosing the light-emitting chip and the light-admitting chip, respectively; and a shielding layer formed on the frame and the encapsulants and having a light-emitting hole and a light-admitting hole, wherein the light-emitting hole and the light-admitting hole are positioned above the light-emitting chip and the light-admitting chip, respectively. The optical module package structure uses an opaque glue to reduce costs and total thickness of the package structure.