Optical Module Recessed Board for Signal Speed and Chip Size
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Solution Overview
Problem
The existing optical modules face challenges in achieving high-speed operation due to increased wiring length, which delays electrical signal supply to the control chip, leading to potential performance issues and increased costs associated with larger silicon photonics chip sizes.
Innovation Solution
The optical module design incorporates a recessed portion on the board to accommodate the silicon photonics chip, with a bridge structure using a control chip to shorten wiring length, and employs bonding materials and underfill materials to enhance bonding strength and heat dissipation, reducing the need for wire bonding and minimizing chip size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wire bonding is used to connect the mounting board with the separate board, then electrical signals can be supplied to the semiconductor element, but the wiring length increases causing delay in high-speed operation
Solution Approach 1:
The patent transitions from planar wiring (2D) to three-dimensional vertical interconnection by mounting the semiconductor element directly on the mounting board's surface rather than requiring wire bonding between separate boards. This vertical integration eliminates the need for long wire paths and achieves both reliable electrical connection and high-speed operation.
Solution Approach 2:
The patent extracts and eliminates the wire bonding process from the assembly. By directly mounting the semiconductor element on the mounting board with conductive paste, the invention removes the intermediate wiring step that caused length delays, achieving direct electrical connection without wires.
2Reliability
If the silicon photonics chip size is increased to accommodate the optical waveguide and semiconductor element, then the optical module can function properly, but the chip size increases leading to higher costs
Solution Approach 1:
The patent embeds the semiconductor element directly within a recessed portion of the mounting board, creating a nested structure where the component is housed inside the board's substrate. This nesting approach allows the optical waveguide and semiconductor element to be integrated without requiring a larger external chip area, thus reducing costs while maintaining functionality.
Solution Approach 2:
The patent utilizes the vertical dimension by creating a recessed portion in the mounting board substrate and mounting the semiconductor element on the board's surface rather than expanding the planar chip area. This three-dimensional integration allows proper optical module function within a compact footprint, reducing the required chip size and associated costs.
3Strength
If bonding material is applied between the sidewall and bottom surface of the recessed portion and the second board, then bonding strength is enhanced, but the manufacturing process becomes more complex
Solution Approach 1:
The patent combines multiple bonding functions into a single application of bonding material that simultaneously bonds the first board to the second board and provides underfill protection. This merged bonding approach enhances bonding strength while avoiding the need for separate bonding steps, thus not increasing manufacturing process complexity.
Solution Approach 2:
The bonding material is applied in advance during the assembly process to fill the recessed portion before final bonding. This preliminary action ensures proper bonding strength and underfill protection are achieved as part of the standard assembly sequence, avoiding additional complex steps during manufacturing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces wiring length, enables high-speed operation, miniaturizes the silicon photonics chip, lowers costs, and improves bonding strength and heat dissipation, thereby enhancing the optical module's performance and reliability.
Implementation Method 1
a first bonding material disposed between a sidewall and a bottom surface of the recessed portion and the second board so as to bond the first board and the second board to each other
Implementation Method 2
a second board accommodated in the recessed portion and includes an optical waveguide and a second conductor layer
Data Source
AI summary
An optical module includes a first board that includes a recessed portion and a first conductor layer, a second board accommodated in the recessed portion and includes an optical waveguide and a second conductor layer, a semiconductor element installed across the first board and the second board and coupled to the first conductor layer and the second conductor layer, and a first bonding material disposed between a sidewall and a bottom surface of the recessed portion and the second board so as to bond the first board and the second board to each other.