Optical Module Package With Recessed Substrate And Stop Wall
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Solution Overview
Problem
Existing optical module packages face manufacturing complexity and difficulty due to the need for a metal frame engagement structure and gluing process, which can result in glue overflow or insufficient bonding, leading to crosstalk interference and reduced light isolation.
Innovation Solution
An optical module package design featuring a substrate with recessed portions and a cover forming separate chambers for light-emitting and light-receiving chips, encapsulated with light-transmissive resin colloids and a conducting layer, which simplifies manufacturing and reduces crosstalk by positioning the cover below the substrate surface, using a resin cover for adjustability and enhanced performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a metal frame with engagement structure is used to pack the encapsulation colloid, then light isolation effect is improved, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The invention extracts and removes the complex metal frame engagement structure from the packaging design. Instead of using a metal frame with engagement structures, the patent uses a simplified substrate with integrated light-shielding layers and encapsulation colloids that directly provide both structural support and light isolation functions, eliminating the need for separate metal frame components and their engagement structures.
Solution Approach 2:
The substrate is designed to perform multiple functions simultaneously: it provides mechanical support for the light-emitting and light-receiving chips, integrates light-shielding layers to prevent crosstalk, and incorporates encapsulation colloids for protection. This multi-functional integration eliminates the need for separate metal frame structures, reducing device complexity while maintaining light isolation effectiveness.
2Stability of the object's composition
If a gluing process is used to bond the metal frame, then structural stability is improved, but manufacturing precision deteriorates due to glue overflow or insufficient bonding
Solution Approach 1:
The invention replaces the mechanical gluing process with a integrated substrate design where light-shielding layers and encapsulation colloids are directly formed or bonded to the substrate using semiconductor manufacturing techniques. This eliminates the need for separate gluing operations, avoiding glue overflow or insufficient bonding issues while maintaining structural stability.
3Strength
If excessive glue is applied to bond the metal frame, then bonding strength is improved, but manufacturing precision deteriorates due to glue overflow
Solution Approach 1:
The patent eliminates the gluing process entirely by integrating light-shielding layers and encapsulation colloids directly onto the substrate using semiconductor manufacturing techniques. This replacement of the mechanical gluing system with a integrated fabrication process eliminates glue overflow problems while ensuring adequate bonding strength through direct formation or bonding.
4Manufacturing precision
If insufficient glue is applied to bond the metal frame, then manufacturing precision is improved by avoiding glue overflow, but reliability deteriorates due to metal frame falling off or moving out of place
Solution Approach 1:
The invention removes the metal frame structure entirely, eliminating the reliability issues associated with glue application. The light-shielding function is achieved through integrated layers on the substrate that are inherently stable and do not require separate bonding operations, ensuring both manufacturing precision and long-term reliability.
Solution Approach 2:
The substrate is designed to provide both structural support and light isolation functions through integrated layers. This multi-functional design eliminates the need for separate metal frame components that would require bonding, ensuring reliable positioning without compromising manufacturing precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution simplifies the manufacturing process, reduces crosstalk interference, and enhances the optical module's performance and application flexibility while lowering production costs and complexity.
Implementation Method 1
each encapsulation colloid comprises a light guide portion protruded from one side thereof opposite to the substrate
Implementation Method 2
The reflective layer has a diameter gradually increasing in direction from an inner side toward an opposing outer side thereof
Data Source
AI summary
An optical module package includes a substrate having a recessed portion, a cover covered on the substrate and defining with the substrate a first chamber and a second chamber therebetween, the cover having a light-emitting hole disposed in communication with the first chamber, a light-receiving hole disposed in communication with the second chamber and a stop wall positioned in the recessed portion to separate the first chamber and the second chamber, a light-emitting chip and a light-receiving chip mounted at the substrate and respectively disposed in the first chamber and the second chamber, and two encapsulation colloids respectively mounted in the first chamber and the second chamber and respectively wrapped about the light-emitting chip and the light-receiving chip. Thus, the optical module package not only can prevent crosstalk but also can greatly reduce the manufacturing cost and the level of difficulty.