Optical Module Monolithic Reflector Lens Carrier
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Solution Overview
Problem
Existing optical modules with integrated semiconductor lasers and lenses face challenges in achieving precise optical coupling due to manufacturing inaccuracies, leading to poor optical coupling characteristics and increased manufacturing costs from the need for multiple components and complex positioning.
Innovation Solution
An optical module design with a monolithically integrated reflector in the semiconductor laser and a separately positioned lens on a light-transmissive carrier, allowing for easier optical axis adjustment and reduced component count, utilizing indium phosphide semiconductor for the laser and silicon for the carrier to enhance processing precision.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the reflector and lens are integrally built in the same semiconductor substrate, then the manufacturing process is simplified, but the optical coupling characteristics deteriorate due to manufacturing accuracy limitations
Solution Approach 1:
The patent divides the optical system into separate components: the semiconductor laser with reflector remains integrated, while the lens is separated and mounted on a carrier. This segmentation allows the lens to be positioned with higher precision relative to the laser output, improving optical coupling characteristics while maintaining manufacturing feasibility through modular assembly.
Solution Approach 2:
The patent introduces a carrier as an intermediary component that holds the lens and positions it relative to the semiconductor laser. This carrier serves as a mediator that enables precise optical axis alignment between the laser and lens, resolving the precision issue while keeping the overall manufacturing process manageable.
2Ease of manufacture
If the reflector and lens positions depend on manufacturing accuracy, then the manufacturing process is simpler, but the optical coupling characteristics worsen when positioning accuracy is insufficient
Solution Approach 1:
The lens is pre-mounted on the carrier with precise positioning features before the semiconductor laser is attached. This preliminary action ensures that the optical axis alignment is established in advance, making the final assembly more reliable and less dependent on the precision of the semiconductor substrate manufacturing process.
3Ease of operation
If the semiconductor laser, lens, and reflector are independently separate, then the optical axis adjustment becomes flexible, but the device complexity and manufacturing costs increase
Solution Approach 1:
The patent merges the semiconductor laser and reflector into a single integrated component, reducing the total number of parts. At the same time, it keeps the lens separate on a carrier for adjustable positioning. This hybrid approach maintains optical axis adjustment flexibility while reducing device complexity compared to having all three components completely separate.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design simplifies optical axis adjustment and reduces manufacturing complexity, improving optical coupling efficiency while minimizing component costs by leveraging the precise processing capabilities of silicon for the carrier's lens.
Implementation Method 1
a reflector for reflecting the light outgoing from the active layer in a direction along the first surface toward another direction
Implementation Method 2
a lens integrally on the fourth surface... the light focused by the lens should have a beam waist in a desired diameter
Data Source
AI summary
An optical module includes a semiconductor laser with an active layer disproportionately positioned closer to the first surface. The semiconductor laser includes a reflector for reflecting the light outgoing from the active layer in a direction along the first surface toward another direction. The active layer and the reflector are monolithically integrated in the semiconductor laser. The optical module includes a carrier formed from a light transmissive material and having a third surface and a fourth surface opposite to each other. The semiconductor laser is mounted on the carrier so as for the light to enter the third surface. The carrier has a lens integrally on the fourth surface. The optical module includes a substrate having an optical waveguide and an optical coupler for guiding the light to the optical waveguide. The optical waveguide and the optical coupler are integrated in the substrate.