Optical Module Rigid PCB Gold Wire Signal Integrity
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Solution Overview
Problem
Current optical module packaging technologies face challenges in transmitting high-speed electrical signals due to significant signal attenuation from solder joints, limiting their use to rates below 10G, and require innovative designs to integrate optical and electrical signal conversion effectively.
Innovation Solution
The optical module design incorporates a rigid PCB with a heat sink, where the laser emitter is directly connected to the PCB via a gold wire, eliminating flexible boards and solder joints, and includes an optical system with a lens assembly and wavelength division multiplexer to transmit light between the laser emitter and optical interface, while using an assembly tolerance absorbing assembly to manage alignment and heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a flexible circuit board is used to absorb assembly tolerances, then assembly flexibility is improved, but electrical signal attenuation increases significantly
Solution Approach 1:
The patent removes the flexible circuit board from the system entirely, extracting the source of signal attenuation. Instead, it uses a rigid PCB with precision positioning features and a movable optical assembly to achieve tolerance absorption without compromising signal integrity.
Solution Approach 2:
The rigid PCB is designed with integrated positioning structures and the movable optical assembly serves multiple functions: it absorbs assembly tolerances, enables signal transmission, and provides adjustable optical alignment, replacing what previously required separate flexible board components.
2Speed
If transmission rate is increased beyond 10G, then data communication performance is improved, but signal attenuation from solder joints becomes unacceptable
Solution Approach 1:
The patent eliminates solder joints by removing the flexible circuit board and its associated solder connections. The direct mounting of the optical assembly on the rigid PCB through precision positioning structures removes the harmful solder joint interface that causes signal attenuation at high transmission rates.
3Adaptability or versatility
If gold contact fingers, PCBA, optoelectronic chip, free-space optical path assembly, and optical port are assembled together, then functional integration is improved, but alignment precision and assembly complexity increase
Solution Approach 1:
The patent divides the optical module into distinct functional segments: a rigid PCB for electrical connections, a separate movable optical assembly containing the free-space optical path, and precision positioning structures. This segmentation allows each component to be optimized independently while maintaining overall alignment through the positioning mechanisms.
Solution Approach 2:
The optical assembly is designed to be movable rather than fixed, allowing dynamic adjustment during assembly and operation. This dynamic capability enables precise alignment compensation for manufacturing tolerances while maintaining functional integration of all components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design reduces signal loss, enables higher transmission rates beyond 10G, and ensures reliable performance with improved heat dissipation and assembly tolerance management, addressing the limitations of existing technologies.
Implementation Method 1
a heat sink arranged in the housing, a laser emitter arranged on the heat sink
Implementation Method 2
The optical system transmits light emitted from the laser to the optical interface
Data Source
AI summary
An optical module includes: a housing, a heat sink arranged in the housing, a laser emitter arranged on the heat sink, a PCB partially arranged on the heat sink, and an optical system arranged in the housing. The optical module has an optical interface on one end and an electrical interface on the other end. The optical system is arranged between the laser emitter and the optical interface. The PCB is constructed as a rigid board. The laser emitter is electrically connected to the PCB. One end of the PCB is fixed on the heat sink, and the other end of the PCB is constructed as the electrical interface. The optical system transmits light emitted from the laser emitter to the optical interface.