Optical Module Solder-Sealed Cavity for Airtight High-Speed Signals
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Solution Overview
Problem
Existing optical modules face challenges in achieving high-speed signal transmission rates while maintaining airtightness, especially in harsh environments, due to the complexity and cost of high-temperature co-fired ceramic processes, limiting their applicability in outdoor and harsh environments.
Innovation Solution
The optical module employs a package design with a soldering member to create a sealed cavity, using a soldering member to seal the gap between the circuit board and package body, and incorporates a water vapor barrier layer to prevent moisture ingress, while utilizing a glass optical window with anti-reflection coating for enhanced light transmission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If high-temperature co-fired ceramic process is used to achieve airtightness, then airtightness is improved, but manufacturing complexity and cost increase
Solution Approach 1:
The patent replaces expensive, complex high-temperature co-fired ceramic processes with a simpler, more cost-effective sealing approach using conventional materials and processes that achieve the same airtightness function without the manufacturing complexity
Solution Approach 2:
The patent changes the sealing approach from high-temperature ceramic firing to a different parameter regime using lower-temperature, simpler sealing methods that achieve equivalent airtightness performance through alternative material properties or structural designs
2Reliability
If high-temperature co-fired ceramic process is used to achieve airtightness, then airtightness is improved, but production cost increases
Solution Approach 1:
The patent substitutes expensive ceramic sealing processes with cheaper, more economical sealing methods using conventional materials that provide equivalent airtightness protection, significantly reducing production costs
3Reliability
If complex sealing processes are used to maintain airtightness in harsh environments, then reliability in harsh environments is improved, but device complexity increases
Solution Approach 1:
The patent extracts the essential sealing function from complex multi-step ceramic processes and implements it through a simpler, dedicated sealing structure that provides the same environmental protection without the manufacturing complexity
Solution Approach 2:
The patent uses simpler, more manageable sealing materials and methods that are easier to manufacture and maintain while providing equivalent protection against harsh environmental conditions
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design achieves airtightness and high-speed signal transmission, enabling the optical module to operate effectively in various environments, including outdoor and 5G applications, while reducing production costs and complexity.
Implementation Method 1
The soldering member is located in a gap between the circuit board and the package body
Implementation Method 2
The optical window is located at the optical window opening. The light-emitting assembly or the light receiving assembly is located in the cavity and is electrically connected to the circuit board. At least one of the optical signal emitted by the light-emitting assembly or the optical signal received by the light receiving assembly is transmitted through the optical window
Implementation Method 3
The light-emitting assembly is configured to convert an electrical signal from the circuit board into an optical signal and emit the optical signal to an outside of the optical module
Implementation Method 4
the light receiving assembly is configured to convert the optical signal from the outside of the light module into an electric signal and transmit the electric signal to the circuit board
Data Source
AI summary
An optical module includes a housing, a circuit board, a package, and at least one of a light-emitting assembly or a light receiving assembly. The package includes a package body and a soldering member. The package body includes a cavity. An end of the circuit board is inserted into the cavity, and the soldering member is located in a gap between the circuit board and the package body. The light-emitting assembly or the light receiving assembly is located in the cavity and electrically connected to the circuit board. The light-emitting assembly is configured to convert an electrical signal from the circuit board into an optical signal and emit the optical signal to an outside of the optical module, and the light receiving assembly is configured to convert the optical signal from the outside of the light module into an electric signal and transmit the electric signal to the circuit board.