Optical Module Sealed Cavity for Immersion Cooling Stability
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Solution Overview
Problem
Conventional optical modules suffer from low cooling efficiency and risk of cooling liquid penetration into the optical path, leading to issues such as abnormal reflection, refraction, and scattering, and potential module failure when using immersion liquid cooling solutions.
Innovation Solution
An optical module design that includes a sealed cavity formed by a potting body and circuit assembly, isolating the light beam propagation path from the cooling medium, with heat dissipation cavities on both sides of the circuit assembly to facilitate efficient heat dissipation using immersion liquid cooling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If immersion liquid cooling is applied to optical modules, then cooling efficiency is improved, but cooling liquid may penetrate into the optical path causing abnormal reflection, refraction, and scattering
Solution Approach 1:
The optical module is divided into separate functional regions: a sealed optical path region and an unsealed heat dissipation region. The circuit board is partitioned such that the optical component mounting area is enclosed by a sealed structure, while other areas remain exposed for cooling liquid contact. This spatial segmentation allows simultaneous achievement of optical path protection and effective cooling.
Solution Approach 2:
A sealed structure acts as an intermediary barrier between the cooling liquid and the optical path. This sealing structure includes sealed side walls extending from the circuit board edge, forming a closed enclosure that prevents cooling liquid penetration while allowing heat to be dissipated through designated heat dissipation regions that are exposed to the cooling medium.
2Temperature
If traditional cooling solutions (TEC, heat pipes, vapor chambers) are used, then cooling capability is improved, but cost, power consumption, and manufacturing complexity increase
Solution Approach 1:
The patent extracts and removes complex cooling components (TEC, heat pipes, vapor chambers) from the optical module design. Instead, it adopts a simplified immersion liquid cooling approach where the cooling liquid directly contacts the circuit board in unsealed regions, eliminating the need for intermediate cooling devices and significantly reducing system complexity, cost, and power consumption.
Solution Approach 2:
The circuit board itself serves as the heat dissipation structure through its natural thermal conductivity and surface area. The board's metal layers and substrate material provide inherent heat spreading capability, eliminating the need for additional heat sinks or thermal management components. The cooling liquid directly interacts with the circuit board surface to achieve passive, efficient cooling.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively prevents cooling medium penetration into the beam propagation path, ensuring stable operation and enhancing heat dissipation efficiency, thereby addressing the limitations of traditional cooling methods.
Implementation Method 1
a potting body arranged on the circuit assembly and cooperating with the circuit assembly to form a sealed cavity
Implementation Method 2
a cooling medium that has entered the housing assembly comes into contact with the circuit assembly to dissipate heat
Implementation Method 3
the cooling medium entering the housing assembly can contact the circuit assembly for heat dissipation
Data Source
AI summary
An optical module, comprising a housing assembly (10) and a circuit assembly (20), wherein the circuit assembly (20) is arranged inside the housing assembly (10); and the circuit assembly (20) has a first side (M) and a second side (N), which are arranged opposite each other. The optical module further comprises a potting body (30), wherein the potting body (30) is arranged on the circuit assembly (20), and cooperates with the circuit assembly (20) to create a sealed cavity (31), which is located on the first side (M). The optical module further comprises a light emitting/receiving element, a lens (42) and a light guide component (43), wherein a light beam propagation path (P), which is cooperatively formed by the light-emitting/receiving element, the lens (42) and the light guide component (43), is located in the sealed cavity (31); and the second side (N) is in communication with the outside of the housing assembly (10), such that a cooling medium that has entered the housing assembly (10) can come into contact with the circuit assembly (20) to dissipate heat.