Optical Module Sealing Piece and Wave-Absorbing Pad for EMI Reduction
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing optical modules generate electromagnetic interference (EMI) due to electromagnetic waves radiating from the gap between the optical fiber ribbon and the blocking piece, affecting nearby electronic devices and making it difficult to achieve effective sealing and reduce EMI.
Innovation Solution
Incorporating a first sealing piece between the circuit board and the optical interface to block the gap between the optical fiber ribbon and the blocking piece, and using a wave-absorbing pad on the circuit board to absorb and scatter electromagnetic waves, thereby reducing radiation and interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If the housing and circuit board are tightly fitted to achieve sealing, then electromagnetic shielding is improved, but manufacturing difficulty increases
Solution Approach 1:
The sealing structure is divided into multiple independent sealing pieces (first sealing piece, second sealing piece, third sealing piece) that are positioned at different locations within the housing. Each sealing piece addresses specific gap areas separately, making the overall sealing system easier to manufacture and assemble while maintaining effective electromagnetic shielding coverage.
2Object-affected harmful factors
If a sealing structure is added to block electromagnetic waves, then electromagnetic shielding is improved, but device complexity increases
Solution Approach 1:
The sealing pieces are designed as thin, flexible components that can be easily positioned and fixed within the housing structure. These thin-film sealing elements effectively block electromagnetic wave paths without adding significant structural complexity or volume to the device.
3Object-generated harmful factors
If the first sealing piece blocks the gap between optical fiber ribbon and blocking piece, then electromagnetic radiation is reduced, but manufacturing precision requirements increase
Solution Approach 1:
The first sealing piece acts as an intermediary component inserted between the optical fiber ribbon and the blocking piece to seal the gap. This mediator component is designed to accommodate normal manufacturing tolerances while still effectively blocking the electromagnetic radiation path, reducing the precision requirements compared to direct tight-fitting designs.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces EMI by blocking and absorbing electromagnetic waves, improving the sealing performance and electromagnetic shielding of the optical module, thus minimizing interference with other devices.
Implementation Method 1
The first sealing piece is configured to block a gap between the optical fiber ribbon and the blocking piece. When the optical module is working, an electromagnetic wave generated at the optical transceiver device is radiated to the first sealing piece and is reflected by the first sealing piece.
Implementation Method 2
a wave-absorbing pad is disposed on the circuit board. An opening is provided on the wave-absorbing pad. The wave-absorbing pad surrounds a lens component inside through the opening. The wave-absorbing pad is configured to absorb an incident electromagnetic wave.
Data Source
AI summary
The present disclosure discloses an optical module, and relates to the field of optical fiber communication technologies. A first sealing piece is configured to block the gap between the optical fiber ribbon and the blocking piece. For the optical module and an optical communication terminal provided in the present application, an electromagnetic wave generated by the optical module is directly radiated or is reflected several times until the electromagnetic wave enters a wave-absorbing pad. The wave-absorbing pad absorbs to the greatest extent an electromagnetic wave generated by a chip, and can reduce to the greatest extent electromagnetic interference (EMI) generated by the optical module. By means of the present disclosure, the sealing performance of a housing of the optical module can be improved, so that an EMI shielding effect is improved, thereby effectively reducing EMI.