Optical Module with Segmented Lead Frames for Axis Alignment
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Solution Overview
Problem
Conventional optical modules for short-haul optical communication face challenges in achieving high accuracy of optical axis alignment and mass productivity while maintaining high transmission quality and efficiency.
Innovation Solution
The optical module design includes an optical semiconductor section with embedded leads and molded bodies that form metal junctions, allowing for precise alignment and adjustment of optical paths, combined with a ferrule guide portion for accurate optical fiber insertion, enabling high alignment accuracy and mass production capabilities.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional optical modules use simple structures with lead frames and molded bodies, then manufacturing cost is reduced and productivity is improved, but optical axis alignment accuracy is insufficient
Solution Approach 1:
The optical module is divided into separate functional sections: an optical semiconductor section with its own lead frame and molded body, and an optical element section with its own lead frame and molded body. Each section can be manufactured and aligned independently, then assembled together. This segmentation allows for precise optical axis alignment between sections while maintaining simple individual structures that are easy to manufacture.
2Productivity
If conventional optical modules prioritize high coupling efficiency and optical transmission quality, then transmission performance is improved, but mass productivity needs to be improved
Solution Approach 1:
The optical semiconductor element is pre-aligned and fixed onto the first lead frame with the first molded body before final assembly. This preliminary action ensures that the optical axis alignment is established early in the manufacturing process, maintaining high optical transmission quality. The pre-assembled unit can then be efficiently produced in mass using standardized procedures.
3Manufacturing precision
If conventional optical modules use embedded leads and molded bodies, then manufacturing simplicity is improved, but alignment accuracy between optical elements is insufficient
Solution Approach 1:
The lead frames serve as intermediary structures that provide precise mechanical support and alignment references for the optical elements. The first lead frame holds the optical semiconductor element, while the second lead frame holds the optical element. These intermediary lead frames enable accurate alignment between optical elements while maintaining the manufacturing simplicity of embedded lead and molded body structures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design ensures high accuracy in optical axis alignment, supports high-capacity data transmission, and enhances mass productivity, making it suitable for short-haul optical communication and interconnection applications.
Implementation Method 1
an optical element section including a third lead, a fourth lead with one end portion opposed to one end portion of the third lead, and a second molded body in which the one end portion of the third lead and the one end portion of the fourth lead are embedded and which can change the optical path of at least one of emitted light from the optical semiconductor element and incident light on the optical semiconductor element
Data Source
AI summary
An optical module includes: an optical semiconductor section including a first lead, a second lead with one end portion opposed to one end portion of the first lead, an optical semiconductor element bonded onto the first lead, and a first molded body in which the optical semiconductor element, the one end portion of the first lead, and the one end portion of the second lead are embedded; and an optical element section including a third lead, a fourth lead with one end portion opposed to one end portion of the third lead, and a second molded body in which the one end portion of the third lead and the one end portion of the fourth lead are embedded and which can change the optical path of at least one of emitted light from the optical semiconductor element and incident light on the optical semiconductor element. The other end portion of the first lead and the other end portion of the second lead protrude from the first molded body in directions opposite to each other. The other end portion of the third lead and the other end portion of the fourth lead protrude from the second molded body in directions opposite to each other. The protruding first lead and the protruding third lead are joined to form a metal junction. The protruding second lead and the protruding fourth lead are joined to form a metal junction. And at least one of the first and second leads and the third and fourth leads have a bent portion which is convex outward.


